Narrow Your Results
Introduction & Scope The Metal Powder Industries Federation (MPIF) is a voluntary-membership
The purpose of this test is to measure bond strengths, evaluate bond strength distributions, or determine compliance with specified bond strength requirements of the applicable acquisition document. This test may be applied to the wire-to-die bond, wire-to-substrate...
Purpose. This test is performed to determine whether the design of the terminals and their method of attachment can withstand one or more of the applicable mechanical stresses to which they will be subjected during installation or disassembly in equipment. These stresses must be...
The test method described in this part of IEC 62137 is applicable to gull-wing lead surface mounting components. The method is designed to test and evaluate the endurance of the solder joint between component leads and lands on a substrate, by means of a pull type mechanical...
NOTE: Modify scope to clearly include desired capabilities of the public address system. a. This work includes design and providing a new, complete, public address system as [required and as ]described herein for the [building name]. Provide a turnkey system capable of receiving, processing, and...
The test method described in this part of IEC 62137 is applicable to leadless surface mounting components and surface mounting connectors to which pull test is not applicable. It is not applicable to multi-lead components and gull-wing leads. The method is designed to...
This specification covers the general requirements and test procedures for single and triple pole, tripfree, thermal, remote control circuit breakers for use in electric systems conforming to MIL-STD-704. These remote control circuit breakers are capable of being remotely set or tripped and...
4.1 The nondestructive wire-bond pull test provides a screen for evaluating wire-bond quality and is capable of detecting weak or nonadherent bonds. 4.2 The test is not destructive and does not damage acceptable wire bonds. 4.3 This practice provides a...
This practice covers nondestructive testing of individual wire bonds made by either ultrasonic, thermal compression or thermosonic techniques. The test is intended to reveal (by breaking) nonacceptable wire bonds but is designed to avoid damage to acceptable wire...
IEC 61010-2-032:2012 specifies safety requirements for HAND-HELD and hand-manipulated current sensors described below. These current sensors are for measuring, detecting or injecting current, or indicating current waveforms on circuits without physically opening the current path of the circuit...
The nondestructive wire-bond pull test provides a screen for evaluating wire-bond quality and is capable of detecting weak or nonadherent bonds. The test is not destructive to acceptable wire bonds. This practice provides a procedure for identifying a...
1.1 This practice covers nondestructive testing of individual wire bonds made by either ultrasonic, thermal compression or thermosonic techniques. The test is destructive to nonacceptable wire bonds but is designed to avoid damage to acceptable wire bonds. Note...
1.1 This practice covers nondestructive testing of individual wire bonds made by either ultrasonic, thermal compression or thermosonic techniques. The test is destructive to nonacceptable wire bonds but is designed to avoid damage to acceptable wire bonds. Note...
4.1 The nondestructive wire-bond pull test provides a screen for evaluating wire-bond quality and is capable of detecting weak or nonadherent bonds. 4.2 The test is not destructive and does not damage acceptable wire bonds. 4.3 This practice provides a...
1.1 These test methods cover tests to determine the pull strength of a series of wire bonds. Instructions are provided to modify the methods for use as a referee method. The methods can be used for wire bonds made with wire having a diameter of from 0.0007...
1.1 These test methods cover tests to determine the pull strength of a series of wire bonds. Instructions are provided to modify the methods for use as a referee method. The methods can be used for wire bonds made with wire having a diameter of from 0.0007...
1.1 This test method establishes the requirements for a standardized method of evaluating the quality of crimped-type electrical connections to solid or stranded conductors. This test method applies to 16-gauge and smaller diameter copper wire, coated or uncoated. 1.2 This...
