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CSA WIRING STANDARDS - CSA BUILDING WIRING STANDARDS SET ***W/D NO S/S***
CSA
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SAE AIR6808 - Aerospace Vehicle Wiring, Lessons Learned
April 1, 2020 - SAE

This SAE Aerospace Information Report (AIR) is limited to the requirements of AS50881 and examines these requirements, providing rationale behind them. AS50881 is only applicable to the aircraft electrical wiring and interconnect system (EWIS). Pods and other devices that can be attached to...

QML-31032 - Printed Circuit Board/Printed Wiring Board, General Specification for
July 28, 2020 - NPFC

QUALIFIED PRODUCT LIST OF PRODUCTS QUALIFIED UNDER PERFORMANCE SPECIFICATION MIL-PRF-31032 Printed Circuit Board/Printed Wiring Board, General Specification for This list has been prepared for use by or for the Government in the acquisition of products covered by the subject specification...

MIL-PRF-55110 - PRINTED WIRING BOARD, RIGID, GENERAL SPECIFICATION FOR
May 16, 2020 - NPFC

Scope. This specification establishes the performance and qualification requirements for rigid single-sided, double-sided, and multilayered printed wiring boards with or without plated through holes (see 6.1). Verification is accomplished through the use of MIL−PRF−31032 and its associated...

QPL-50884 - Printed Wiring Board, Flexible or Rigid-Flex, General Specification for
July 7, 2020 - NPFC

QUALIFIED PRODUCT LIST OF PRODUCTS QUALIFIED UNDER PERFORMANCE SPECIFICATION MIL-PRF-50884 Printed Wiring Board, Flexible or Rigid-Flex, General Specification for This list has been prepared for use by or for the Government in the acquisition of products covered by the subject specification...

MIL-DTL-39024 - JACK, TIP (TEST POINT, PANEL OR PRINTED WIRING TYPE), GENERAL SPECIFICATION FOR
June 3, 2020 - NPFC

Scope. This specification covers the general requirements for panel or printed wiring type test point connectors for use in electrical and electronic equipment (see 6.1). As used in this specification, the term "connectors" includes tip jacks.

MIL-HDBK-525 - ELECTRICAL WIRING INTERCONNECT SYSTEM (EWIS) INTEGRITY PROGRAM
March 24, 2020 - NPFC

Scope This handbook provides weapons systems program offices a systematic process that includes a series of core tasks used to assess an aircraft Electrical Wiring Interconnect System (EWIS) for overall condition, service life extension, and continued airworthiness. It aligns with the...

ARINC 628P5 - CABIN EQUIPMENT INTERFACES (CEI) PART 5 CABIN ELECTRICAL EQUIPMENT AND WIRING INSTALLATION GUIDELINES
July 24, 2020 - ARINC

ARINC Specification 628, Part 5, provides design and mounting requirements, guidelines, and recommendations for electrical installations mainly for suppliers of cabin furnishing equipment. The first paragraph of each section contains general requirements and guidelines applicable to typical...

ISO DIS 11452-9 - Road vehicles — Component test methods for electrical disturbances from narrowband radiated electromagnetic energy — Part 9: Portable transmitters
July 15, 2020 - ISO

This part of ISO 11452 specifies test methods and procedures for testing electromagnetic immunity of electronic components for passenger cars and commercial vehicles to portable transmitters in close proximity, regardless of the propulsion system (e.g. spark-ignition engine, diesel engine, electric...

QPL-55110 - Printed Wiring Board, Rigid, General Specification for
February 27, 2020 - NPFC

QUALIFIED PRODUCT LIST OF PRODUCTS QUALIFIED UNDER PERFORMANCE SPECIFICATION MIL-PRF-55110 Printed Wiring Board, Rigid, General Specification for This list has been prepared for use by or for the Government in the acquisition of products covered by the subject specification and such listing...

MIL-PRF-31032/6 - PRINTED WIRING BOARD, RIGID, SINGLE AND DOUBLE SIDED, THERMOPLASTIC OR THERMOSETTING RESIN BASE MATERIAL, WITH OR WITHOUT PLATED-THROUGH HOLES, FOR HIGH FREQUENCY APPLICATIONS
May 6, 2020 - NPFC

Scope. This specification covers the generic performance requirements for single and double sided (one or two conductor layers) printed wiring boards (hereafter designated printed board) with or without plated holes, constructed of thermoplastic or thermosetting base materials, that will use...

MIL-PRF-31032/5 - PRINTED WIRING BOARD, RIGID, MULTILAYERED, THERMOPLASTIC, THERMOSETTING, OR THERMOPLASTIC AND THERMOSETTING RESIN BASE MATERIAL, WITH PLATED-THROUGH HOLES, FOR HIGH FREQUENCY APPLICATIONS
May 5, 2020 - NPFC

Scope. This specification covers the generic performance requirements for rigid, multilayered (three or more conductor layers) printed wiring boards (hereafter designated printed board) with plated holes, constructed of thermoplastic, thermosetting, or thermoplastic and thermosetting base...

EIA-933 - (R) Requirements for a COTS Assembly Management Plan
August 1, 2020 - SAE

This document applies to the development of Plans for integrating and managing COTS assemblies in electronic equipment and Systems for the commercial, military, and space markets; as well as other ADHP markets that wish to use this document. For purposes of this document, COTS assemblies are viewed...

IEC 60749-15 REDLINE - SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHOD - PART 15: RESISTANCE TO SOLDERING TEMPERATURE FOR THROUGH-HOLE MOUNTED DEVICES (REDLINE + STANDARD)
July 1, 2020 - IEC

This part of IEC 60749 describes a test used to determine whether encapsulated solid state devices used for through-hole mounting can withstand the effects of the temperature to which they are subjected during soldering of their leads by using wave soldering. In order to establish a standard test...

IEC 60749-15 - Semiconductor devices – Mechanical and climatic test methods – Part 15: Resistance to soldering temperature for through-hole mounted devices
July 1, 2020 - IEC

This part of IEC 60749 describes a test used to determine whether encapsulated solid state devices used for through-hole mounting can withstand the effects of the temperature to which they are subjected during soldering of their leads by using wave soldering. In order to establish a standard test...

MIL-PRF-31032/4 - PRINTED WIRING BOARD, RIGID FLEX OR FLEXIBLE, MULTILAYER, WITH PLATED−THROUGH HOLES, WITH OR WITHOUT STIFFENERS, FOR SOLDERED PART MOUNTING
April 4, 2020 - NPFC

Scope. This specification covers the generic performance requirements for multilayered (three or more conductor layers) rigid-flex or flexible (with or without stiffeners) printed wiring boards (hereafter designated printed board) with plated holes that will use soldering for component/part...

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