UNLIMITED FREE ACCESS TO THE WORLD'S BEST IDEAS

SUBMIT
Already a GlobalSpec user? Log in.

This is embarrasing...

An error occurred while processing the form. Please try again in a few minutes.

Customize Your GlobalSpec Experience

Select Your Free Newsletters

Industry Newsletters

Select Your Free Product Alerts

Finish!
Privacy Policy

This is embarrasing...

An error occurred while processing the form. Please try again in a few minutes.

IEC 60068-2-69

Environmental testing – Part 2-69: Tests – Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method

active, Most Current
Buy Now
Organization: IEC
Publication Date: 1 June 2019
Status: active
Page Count: 234
ICS Code (Electronic component assemblies): 31.190
ICS Code (Environmental testing): 19.040
scope:

This part of IEC 60068 outlines test Te/Tc, the solder bath wetting balance method and the solder globule wetting balance method to determine, quantitatively, the solderability of the terminations. Data obtained by these methods are not intended to be used as absolute quantitative data for pass-fail purposes.

The procedures describe the solder bath wetting balance method and the solder globule wetting balance method. They are applicable to components and printed boards with metallic terminations and metallized solder pads.

This document provides the measurement procedures for solder alloys both with and without lead (Pb).

Document History

IEC 60068-2-69
June 1, 2019
Environmental testing – Part 2-69: Tests – Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method
This part of IEC 60068 outlines test Te/Tc, the solder bath wetting balance method and the solder globule wetting balance method to determine, quantitatively, the solderability of the terminations....
IEC 60068-2-69
June 1, 2019
Environmental testing – Part 2-69: Tests – Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method AMENDMENT 1
A description is not available for this item.
IEC 60068-2-69
January 1, 2018
ENVIRONMENTAL TESTING – Part 1: 2-69: Tests – Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement)
A description is not available for this item.
IEC 60068-2-69
March 1, 2017
Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method
This part of IEC 60068 outlines test Te/Tc, the solder bath wetting balance method and the solder globule wetting balance method to determine, quantitatively, the solderability of the terminations....
IEC 60068-2-69
May 1, 2007
Environmental testing – Part 2-69: Tests – Test Te: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method
This part of IEC 60068 outlines test Te, solder bath wetting balance method and solder globule wetting balance method, applicable for surface mounting devices. These methods determine quantitatively...
IEC 60068-2-69
December 1, 1995
Environmental Testing - Part 2: Tests - Test Te: Solderability Testing of Electronic Components for Surface Mount Technology by the Wetting Balance Method
A description is not available for this item.
View Less
View All

References

This document references:
IEC 60068-2-20 - Environmental testing – Part 2-20: Tests – Tests Ta and Tb: Test methods for solderability and resistance to soldering heat of devices with leads
Published by IEC on March 1, 2021
This part of IEC 60068 outlines Tests Ta and Tb, applicable to devices with leads and leads themselves. Soldering tests for surface mounting devices (SMD) are described in IEC 60068-2-58. This...
This document references:
IEC 60068-2-2 - Environmental testing – Part 2-2: Tests – Test B: Dry heat
Published by IEC on July 1, 2007
INTRODUCTION General This publication deals with dry heat tests applicable both to heat-dissipating and non heat-dissipating specimens. For non heat-dissipating specimens, Tests Ba and Bb do not...
This document references:
IEC 60068-2-20 - Environmental testing – Part 2-20: Tests – Tests Ta and Tb: Test methods for solderability and resistance to soldering heat of devices with leads
Published by IEC on March 1, 2021
This part of IEC 60068 outlines Tests Ta and Tb, applicable to devices with leads and leads themselves. Soldering tests for surface mounting devices (SMD) are described in IEC 60068-2-58. This...
This document references:
IEC 60068-2-66 - Environmental Testing - Part 2: Test Methods - Test Cx: Damp Heat, Steady State (Unsaturated Pressurized Vapour)
Published by IEC on June 1, 1994
This International Standard provides a standard test procedure for the purpose of evaluating, in an accelerated manner, the resistance of small electrotechnical products, primarily non-hermetically...
This document references:
IEC 60068-3-13 - Environmental testing – Part 3-13: Supporting documentation and guidance on Test T – Soldering
Published by IEC on May 1, 2016
This part of IEC 60068 provides background information and guidance for writers and users of specifications for electric and electronic components, containing references to the test standards IEC...
This document is referenced by:
IEEE C62.43.1 - Errata to IEEE Guide for Surge Protectors and Surge Protective Circuits Used in Information and Communication Technology Circuits (ICT), Including Smart Grid—Part 1 Applications
Published by IEEE on July 20, 2020
A description is not available for this item.
This document is referenced by:
IEC 61400-24 - Wind energy generation systems – Part 24: Lightning protection
Published by IEC on July 1, 2019
This part of IEC 61400 applies to lightning protection of wind turbine generators and wind power systems. Refer to Annex M guidelines for small wind turbines. This document defines the lightning...
This document is referenced by:
CEI EN 60068-2-39 - Environmental testing Part 2-39: Tests - Tests and guidance: Combined temperature or temperature and humidity with low air pressure tests
Published by CEI on February 1, 2017
A description is not available for this item.
This document is referenced by:
CEI EN 60728-13-1 - Cable networks for television signals, sound signals and interactive services Part 13-1: Bandwidth expansion for broadcast signal over FTTH system
Published by CEI on February 1, 2018
The purpose of this part of IEC 60728 is the precise description of an FTTH (fibre to the home) system for expanding broadband broadcast signal transmission from CATV services only, towards CATV plus...
This document is referenced by:
BS EN IEC 60115-1 - Fixed resistors for use in electronic equipment Part 1: Generic specification
Published by BSI on March 31, 2023
A description is not available for this item.
View Less
View All
Advertisement