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This Addendum provides modified and additional requirements over those published in IPC/WHMA-A-620D to ensure the performance of cable and wire harness assemblies that must survive the vibration and thermal excursions encountered getting to and operating in the military and space...
This standard is a collection of visual quality acceptability requirements for electronic assemblies. This standard does not provide criteria for cross-section evaluation. This document presents acceptance requirements for the manufacture of electrical and electronic assemblies. Historically,...
This standard is a collection of visual quality acceptability requirements for electronic assemblies. This standard does not provide criteria for cross-section evaluation. This document presents acceptance requirements for the manufacture of electrical and electronic assemblies. Historically,...
This standard prescribes practices and requirements for the manufacture of cable, wire and harness assemblies. This standard does not provide criteria for cross-section or X-ray evaluation. If a conflict occurs between the English and translated versions of this document, the English version...
This standard prescribes practices and requirements for the manufacture of cable, wire and harness assemblies. This standard does not provide criteria for cross-section or X-ray evaluation. If a conflict occurs between the English and translated versions of this document, the English version...
This document is intended to assist in selecting the test equipment, test parameters, test data and fixturing required to perform electrical test(s) on flexible printed electronics. Purpose Electrical testing verifies that the conductive networks on the flexible printed electronics are...
This standard establishes the requirements for the omnidirectional exchange of information between manufacturing processes and associated host systems for assembly manufacturing. This standard applies to communication between all executable processes in the manufacture of printed board assemblies -...
This standard establishes and defines the qualification and performance requirements for printed electronics and their forms of component mounting and interconnecting structures on flexible substrates. Flexible substrates, as pertain to this standard, are materials or devices which have some amount...
This Handbook is a companion reference to the J-STD-001 (standard) and is intended to provide supporting information. Additional detailed information can be found in documents referenced within the standard (and this Handbook). Users are encouraged to reference those documents to better understand...
This standard establishes the IPC Digital Twin, which is comprised of the Digital Twin Product, Digital Twin Manufacturing and Digital Twin Lifecycle frameworks. Within the Digital Twin Architecture, this standard stipulates and defines Digital Twin properties, types, complexities and...
This standard establishes minimum requirements for manufacturing and supply chain traceability based on perceived risk. This standard applies to all products, processes, assemblies, parts, components, equipment used and other items as defined by users and suppliers in the manufacture of printed...
This standard specifies the XML schema that represents the intelligent data file format used to describe printed board and printed board assembly products with details sufficient for tooling, manufacturing, assembly, and inspection requirements. This format may be used for transmitting information...
This standard describes design and assembly guidance for implementing bottom termination components (BTCs). The focus of the information contained herein is on critical design, materials, assembly, inspection, repair, quality and reliability issues associated with BTCs. This standard applies only...
This standard establishes the specific requirements for the design of rigid organic printed boards. The following overview describes what are the core knowledge and competencies to best serve in the role of Printed Board Design Layout as a stand-alone professional, or as the engineer performing...
This standard describes materials, methods and acceptance criteria for producing soldered electrical and electronic assemblies. The intent of this document is to rely on process control methodology to ensure consistent quality levels during the manufacture of products. It is not the intent of this...
This standard describes materials, methods and acceptance criteria for producing soldered electrical and electronic assemblies. The intent of this document is to rely on process control methodology to ensure consistent quality levels during the manufacture of products. It is not the intent of this...
