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This part of IEC 63093 specifies the shapes and dimensions of ferrite cores for inductive components (transformers and chokes), whose the coil is typically made of multi-layer boards (or the coil is part of the motherboard), and the effective parameter values used in calculations.This...
IEC 63093-9:2020 specifies the shapes and dimensions of ferrite cores for inductive components (transformers and chokes), whose the coil is typically made of multi-layer boards (or the coil is part of the motherboard), and the effective parameter values used in calculations. This document...
Construct the PC of your dreams using the practical information contained in this hands-on guide. Build Your Own PC on a Budget explains, step-by-step, how to put together a customized computer that is affordable, stable, and powerful. Discover how to choose the parts that fit your needs, safely...
This Standard applies to all parties involved at all levels in the utilization of OTS items into space segment hardware and launchers. For the purpose of this Standard, Off-the-Shelf (OTS) Items are those that, even if not necessarily developed for space applications, can be procured from the...
This International Standard specifies the shapes and dimensions of ferrite cores for inductive components (transformers and chokes) of which the coil is typically constructed by multi-layer board or the coil is part of the motherboard. The general consideration upon which the design of this...
As optical technologies move closer to the core of modern computer architecture, there arise many challenges in building optical capabilities from the network to the motherboard. Rapid advances in integrated optics technologies are making this a reality. However, no comprehensive, up-to-date...
This standard provides a set of uniform data sheet parameters for the description of a single 10-bit, 2.5 V FET transmission-gate bus switch device for DDR memory module and motherboard applications. This bus switch device has a low ON resistance allowing inputs to be connected directly to...
This standard provides a set of uniform data sheet parameters for the description of a dual 5-bit, 2.5 V FET transmission-gate bus switch device for DDR memory module and motherboard applications. This bus switch device has a low ON resistance allowing inputs to be connected directly to...
Scope and object SBus is a high performance computer I/O interface for connecting integrated circuits and SBus Cards to a computer system motherboard. This standard defines the mechanical, electrical, environmental, and protocol requirements for the design of SBus Cards and the computer...
This Part of IEC 63093 specifies the shapes and dimensions of ferrite cores for inductive components (transformers and chokes) of which the coil is typically constructed by multi-layer board or the coil is part of the motherboard and the effective parameter values to be used in calculations....
Joining processes, which attach two or more substrates or base materials together, be they metals, ceramics, or plastics, can be considered as coming under one of two generalized methodologies: filler material joining, or fusion joining. Filler material joining refers to the use of a third material...