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FORD NSP AA-MATERIAL - NSP METRIC AA-MATERIAL & PERFORMANCE SPECIFICATIONS FOR STANDARD AND UTILITY PARTS
January 1, 1995 - FORD
A description is not available for this item.
IPC-4554 GERMAN - Specification for Immersion Tin Plating for Printed Circuit Boards
January 1, 2007 - IPC

Diese Spezifikation legt die Anforderungen an chemisch Zinn-Oberflächen als Endoberflächen von Leiterplatten fest. Sie ist für die Verwendung durch Lieferanten, Leiterplattenhersteller, Elektronik-Dienstleister (EMS) und OEM-Hersteller vorgesehen.

CENBASE MATERIAL - CENBASE MATERIAL DATABASE
DATA
A description is not available for this item.
MPIF POWDER MATERIAL - POWDER METALLURGY - PROCESSING AND MATERIALS
MPIF
A description is not available for this item.
API RP 571 GERMAN - Damage Mechanisms Affecting Fixed Equipment in the Refining Industry
December 1, 2003 - API

General guidance as to the most likely damage mechanisms for common alloys used in the refining and petrochemical industry is provided in this recommended practice. These guidelines provide information that can be utilized by plant inspection personnel to assist in identifying likely causes of...

IPC-4552 GERMAN - Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Circuit Boards
October 1, 2002 - IPC

This specification sets the requirements for the use of Electroless Nickel/Immersion Gold (ENIG) as a surface finish for printed circuit boards. This specification is intended to set requirements for ENIG deposit thicknesses based on performance criteria. It is intended for use by supplier, printed...

SN EN 12163 GERMAN - Copper and copper alloys - Rod for general purposes
January 1, 1998 - SNV
A description is not available for this item.
IPC-6011 GERMAN - Generic Performance Specification for Printed Boards
July 1, 1996 - IPC

Diese Spezifikation legt die allgemeinen Anforderungen an Leiterplatten sowie die Anforderungen an die Qualitätsund Zuverlässigkeitssicherung fest, die für ihre Beschaffung eingehalten werden müssen. Es ist das Ziel dieser Spezifikation, Anwendern und Lieferanten von Leiterplatten die Flexibilität...

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