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IPC-4554 GERMAN

Specification for Immersion Tin Plating for Printed Circuit Boards

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Organization: IPC
Publication Date: 1 January 2007
Status: active
Page Count: 64
scope:

Diese Spezifikation legt die Anforderungen an chemisch Zinn-Oberflächen als Endoberflächen von Leiterplatten fest. Sie ist für die Verwendung durch Lieferanten, Leiterplattenhersteller, Elektronik-Dienstleister (EMS) und OEM-Hersteller vorgesehen.

Document History

IPC-4554 GERMAN
January 1, 2007
Specification for Immersion Tin Plating for Printed Circuit Boards
Diese Spezifikation legt die Anforderungen an chemisch Zinn-Oberflächen als Endoberflächen von Leiterplatten fest. Sie ist für die Verwendung durch Lieferanten, Leiterplattenhersteller,...

References

This document references:
IPC-2221 - Generic Standard on Printed Board Design
Published by IPC on June 1, 2018
A description is not available for this item.
This document references:
IPC-6012 - Medical Applications Addendum to IPC-6012E, Qualification and Performance Specification for Rigid Printed Boards
Published by IPC on August 1, 2020
This Specification covers qualification and performance requirements of Rigid Printed Board for Medical Device Applications. The Printed Boards may have a design that contains HDI and Design Level D...
This document references:
IPC-6013 - Qualification and Performance Specification for Flexible and Rigid-Flexible Printed Boards
Published by IPC on April 1, 2018
A description is not available for this item.
This document references:
IPC-6018 - Qualification and Performance Specification for High Frequency (Microwave) Printed Boards
Published by IPC on July 1, 2016
Statement of Scope This specification covers end product inspection and test of high frequency (microwave) printed boards for microstrip, stripline, mixed dielectric and multilayer stripline...
This document references:
J-STD-003 - Solderability Tests for Printed Boards
Published by IPC on April 1, 2014
This standard prescribes test methods, defect definitions, and illustrations for assessing the solderability of printed wiring board surface conductors, attachment lands, and plated-through holes...
This document references:
IPC-TM-650 2.3.25 - Detection and Measurement of Ionizable Surface Contaminants by Resistivity of Solvent Extract (ROSE)
Published by IPC on November 1, 2012
1 Scope 1.1 Purpose These tests are used as process control tools; they can be used to inspect printed boards or printed board assemblies and determine if they conform to the monitoring level of the...
This document references:
IPC-TM-650 2.4.1 - Adhesion, Tape Testing
Published by IPC on May 1, 2004
This test method uses pressure sensitive tape to determine the adhesion quality of platings, marking inks or paints, and other materials used in conjunction with Printed Boards.
This document references:
IPC-TM-650 2.6.3.5 - Bare Board Cleanliness by Surface Insulation Resistance
Published by IPC on January 1, 2004
This test method is used to characterize the cleanliness of printed wiring board fabrication processes by determining the degradation of electrical insulation resistance under conditions of high...
This document references:
TM-650 2.6.14.1 - Electrochemical Migration Resistance Test
Published by IPC on September 1, 2000
This test method provides a means to assess the propensity for surface electrochemical migration. This test method can be used to assess soldering materials and/or processes.
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