UNLIMITED FREE ACCESS TO THE WORLD'S BEST IDEAS

close
Already an Engineering360 user? Log in.

This is embarrasing...

An error occurred while processing the form. Please try again in a few minutes.

Customize Your Engineering360 Experience

close
Privacy Policy

This is embarrasing...

An error occurred while processing the form. Please try again in a few minutes.

JEDEC JESD 22-B116

Wire Bond Shear Test Method

active, Most Current
Buy Now
Organization: JEDEC
Publication Date: 1 April 2017
Status: active
Page Count: 32
scope:

This test provides a means for determining the strength of a ball bond to a die or package bonding surface, and may be performed on pre-encapsulation or post-encapsulation devices. This measure of bond strength is extremely important in determining two features:

1) the integrity of the metallurgical bond which has been formed, and

2) the quality of ball bonds to die or package bonding surfaces.

This test method covers thermosonic (ball) bonds made with small diameter wire from 15 μm to 76 μm (0.6 mil to 3.0 mil).

This test method can only be used when the bonds are large enough to allow for proper contact with the shear test chisel and when there are no adjacent interfering structures that would hinder the movement of the chisel. For consistent shear results the ball height must be at least 4.0 μm (0.16 mils) for ball bonds, which is the current state of the art for bond shear test equipment at the time of this revision.

This test method can also be used on ball bonds that have had their wire removed and on to which a 2nd bond wire (typically a stitch bond) is placed. This may be known as "stitch on ball" and "reverse bonding". See Annex A for additional information.

The wire bond shear test is destructive. It is appropriate for use in process development, process control, and/or quality assurance.

This test method may be used on ultrasonic (wedge) bonds, however its use has not been shown to be a consistent indicator of bond integrity. See Annex B for information on performing shear testing on wedge bonds.

Document History

JEDEC JESD 22-B116
April 1, 2017
Wire Bond Shear Test Method
This test provides a means for determining the strength of a ball bond to a die or package bonding surface, and may be performed on pre-encapsulation or post-encapsulation devices. This measure of...
August 1, 2009
Wire Bond Shear Test Method
This test provides a means for determining the strength of a gold ball bond to a die bonding surface or an aluminum wedge or stitch bond to a die or package bonding surface, and may be performed on...
July 1, 1998
Test Method B116 Wire Bond Shear Test
A description is not available for this item.

References

Advertisement