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JEDEC JEP 140

Beaded Thermocouple Temperature Measurement of Semiconductor Packages

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Organization: JEDEC
Publication Date: 1 June 2002
Status: active
Page Count: 14

Document History

JEDEC JEP 140
June 1, 2002
Beaded Thermocouple Temperature Measurement of Semiconductor Packages
A description is not available for this item.
JEDEC JEP 140
June 1, 2002
Beaded Thermocouple Temperature Measurement of Semiconductor Packages
The beaded thermocouple temperature measurement guideline provides a procedure to accurately and consistently measure the temperature of semiconductor packages during exposure to thermal excursions....
JEP140
June 1, 2002
Beaded Thermocouple Temperature Measurement of Semiconductor Packages
A description is not available for this item.

References

This document references:
ASTM E220 - Standard Test Method for Calibration of Thermocouples By Comparison Techniques
Published by ASTM on September 1, 2019
This test method describes the principles, apparatus, and procedure for calibrating thermocouples by comparison with a reference thermometer. Calibrations are covered over temperature ranges...
This document is referenced by:
ECIA J-STD-075 - Classification of Passive and Solid State Devices for Assembly Processes
Published by ECIA on May 1, 2018
This industry standard outlines worst case industry solder assembly process conditions for passive and solid state electronic devices (hereafter referred to as “devices). This standard provides...
This document is referenced by:
JEDEC JEP 143 - Solid-State Reliability Assessment and Qualification Methodologies
Published by JEDEC on January 1, 2019
This publication applies to all integrated circuits and their associated packages. The document summarizes the suite of reliability documents and publications available. These documents address...
This document is referenced by:
IEC TR 60068-3-12 - Environmental testing - Part 3-12: Supporting documentation and guidance - Method to evaluate a possible lead-free solder reflow temperature profile
Published by IEC on October 1, 2014
This part of IEC 60068, which is a technical report, presents two approaches for establishing a possible temperature profile for a lead-free reflow soldering process using SnAgCu solder paste. This...
This document is referenced by:
EIA/IPC/JEDEC J-STD-075A - Classification of Passive and Solid State Devices for Assembly Processes
Published by IPC on May 1, 2018
This industry standard outlines worst case industry solder assembly process conditions for passive and solid state electronic devices (hereafter referred to as “devices). This standard provides...
This document is referenced by:
J-STD-020F - Moisture/Reflow Sensitivity Classification for Non-hermetic Surface Mount Devices (SMDs)
Published by JEDEC on December 1, 2022
This classification procedure applies to all non-hermetic SMDs, which, because of absorbed moisture, could be sensitive to damage during solder reflow. The term SMD as used in this document means...
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