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JEDEC JEP 140

Beaded Thermocouple Temperature Measurement of Semiconductor Packages

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Organization: JEDEC
Publication Date: 1 June 2002
Status: inactive
Page Count: 14
scope:

The beaded thermocouple temperature measurement guideline provides a procedure to accurately and consistently measure the temperature of semiconductor packages during exposure to thermal excursions. The guideline applications can include, but not limited to, temperature profile measurement in reliability test chambers and solder reflow operations that are associated with component assembly to printed wiring boards. 

Document History

June 1, 2002
Beaded Thermocouple Temperature Measurement of Semiconductor Packages
A description is not available for this item.
June 1, 2002
Beaded Thermocouple Temperature Measurement of Semiconductor Packages
A description is not available for this item.
JEDEC JEP 140
June 1, 2002
Beaded Thermocouple Temperature Measurement of Semiconductor Packages
The beaded thermocouple temperature measurement guideline provides a procedure to accurately and consistently measure the temperature of semiconductor packages during exposure to thermal excursions....

References

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