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JEDEC JEP 140

Beaded Thermocouple Temperature Measurement of Semiconductor Packages

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Organization: JEDEC
Publication Date: 1 June 2002
Status: inactive
Page Count: 14
scope:

The beaded thermocouple temperature measurement guideline provides a procedure to accurately and consistently measure the temperature of semiconductor packages during exposure to thermal excursions. The guideline applications can include, but not limited to, temperature profile measurement in reliability test chambers and solder reflow operations that are associated with component assembly to printed wiring boards. 

Document History

JEDEC JEP 140
June 1, 2002
Beaded Thermocouple Temperature Measurement of Semiconductor Packages
A description is not available for this item.
JEDEC JEP 140
June 1, 2002
Beaded Thermocouple Temperature Measurement of Semiconductor Packages
The beaded thermocouple temperature measurement guideline provides a procedure to accurately and consistently measure the temperature of semiconductor packages during exposure to thermal excursions....
JEP140
June 1, 2002
Beaded Thermocouple Temperature Measurement of Semiconductor Packages
A description is not available for this item.

References

This document is referenced by:
JEDEC JESD 88 - JEDEC Dictionary of Terms for Solid State Technology
Published by JEDEC on July 1, 2007
Each term and definition in this dictionary has been included strictly for application within the solid-state industry. Many of the terms and definitions in this dictionary may have applicability...
This document is referenced by:
IPC-9641 - High Temperature Printed Board Flatness Guideline
Published by IPC on June 1, 2013
The purpose of this test method is to measure the shape and relative change in shape of a local area of interest (e.g., flip-chip ball grid array (FCBGA) land area) of printed boards through a range...
This document is referenced by:
JEDEC JEP 153 - Characterization and Monitoring of Thermal Stress Test Oven Temperatures
Published by JEDEC on March 1, 2014
This document specifies a uniform and reproducible method of confirming that temperature test chambers meet the requirements specified in thermal stress test procedures. This publication is intended...
This document is referenced by:
J-STD-020F - Moisture/Reflow Sensitivity Classification for Non-hermetic Surface Mount Devices (SMDs)
Published by JEDEC on December 1, 2022
This classification procedure applies to all non-hermetic SMDs, which, because of absorbed moisture, could be sensitive to damage during solder reflow. The term SMD as used in this document means...
This document is referenced by:
JEDEC J-STD-020 GERMAN - Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices
Published by IPC on August 1, 2007
A description is not available for this item.
This document is referenced by:
IPC/JEDEC J-STD-020F - Moisture/Reflow Sensitivity Classification for Non-hermetic Surface Mount Devices (SMDs)
Published by IPC on December 1, 2022
This classification procedure applies to all non-hermetic SMDs, which, because of absorbed moisture, could be sensitive to damage during solder reflow. The term SMD as used in this document means...
This document is referenced by:
IPC-7530 - Guidelines for Temperature Profiling for Mass Soldering Processes (Reflow and Wave)
Published by IPC on March 1, 2017
This standard describes thermal profile guidelines and practical guidelines to meet requirements to produce acceptable solder joints in mass soldering processes, including but not limited to reflow...
This document is referenced by:
JEDEC JESD 22-A104 - Temperature Cycling
Published by JEDEC on November 1, 2020
This standard applies to single-, dual- and triple-chamber temperature cycling in an air or other gaseous medium and covers component and solder interconnection testing. In single chamber cycling,...
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