UNLIMITED FREE
ACCESS
TO THE WORLD'S BEST IDEAS

SUBMIT
Already a GlobalSpec user? Log in.

This is embarrasing...

An error occurred while processing the form. Please try again in a few minutes.

Customize Your GlobalSpec Experience

Finish!
Privacy Policy

This is embarrasing...

An error occurred while processing the form. Please try again in a few minutes.

IPC - TM-650 2.4.29C

Solder Mask - Adhesion to Flexible Circuits

active, Most Current
Organization: IPC
Publication Date: 1 March 2007
Status: active
Page Count: 1
scope:

This test method is used to determine the adhesion quality of solder masks used on flexible circuits.

Document History

TM-650 2.4.29C
March 1, 2007
Solder Mask - Adhesion to Flexible Circuits
This test method is used to determine the adhesion quality of solder masks used on flexible circuits.
February 1, 1988
Adhesion, Solder Mask Flexible Circuits
A description is not available for this item.

References

Advertisement