CENELEC - EN 61191-3
Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies
active, Most Current
| Organization: | CENELEC |
| Publication Date: | 1 September 2017 |
| Status: | active |
| Page Count: | 28 |
| ICS Code (Mechanical structures for electronic equipment): | 31.240 |
scope:
This part of IEC 61191 prescribes requirements for lead and hole solder assemblies. The requirements pertain to those assemblies that totally use through-hole mounting technology (THT), or the THT portions of those assemblies that include other related technologies (i.e. surface mount, chip mounting, terminal mounting).
Document History
EN 61191-3
September 1, 2017
Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies
This part of IEC 61191 prescribes requirements for lead and hole solder assemblies. The requirements pertain to those assemblies that totally use through-hole mounting technology (THT), or the THT...
October 1, 1998
Printed Board Assemblies Part 3: Sectional Specification Requirements for Through-Hole Mount Soldered Assemblies
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