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IPC-4103

Specification for Base Materials for High Speed/High Frequency Applications

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Organization: IPC
Publication Date: 1 November 2017
Status: active
Page Count: 72
scope:

This specification covers the requirements for high speed/high frequency performance plastic substrates to be used for fabrication of printed boards for microstrip, stripline, and high speed digital electrical and electronic circuits. This specification applies to the plastic substrate thickness defined in the specification sheets as measured over the dielectric only. As a general guideline, laminates controlled by this specification usually have a dissipation factor of less than 0.005.

Document History

IPC-4103
November 1, 2017
Specification for Base Materials for High Speed/High Frequency Applications
This specification covers the requirements for high speed/high frequency performance plastic substrates to be used for fabrication of printed boards for microstrip, stripline, and high speed digital...
November 1, 2015
Specification for Base Materials for High Speed/High Frequency Applications
A description is not available for this item.
January 1, 2014
Specification for Base Materials for High Speed/High Frequency Applications
This specification covers the requirements for high speed/high frequency performance plastic substrates to be used for fabrication of printed boards for microstrip, stripline, and high speed digital...
December 1, 2011
Specification for Base Materials for High Speed/High Frequency Applications
This specification covers the requirements for high speed/high frequency performance plastic substrates to be used for fabrication of printed boards for microstrip, stripline, and high speed digital...
January 1, 2002
Specification for Base Materials for High Speed/High Frequency Applications
This specification covers the requirements for high speed/high frequency base materials, herein referred to as laminate or bonding layer, to be used primarily for the fabrication of rigid or...

References

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