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IPC-4103

Specification for Base Materials for High Speed/High Frequency Applications

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Organization: IPC
Publication Date: 1 November 2017
Status: active
Page Count: 72
scope:

This specification covers the requirements for high speed/high frequency performance plastic substrates to be used for fabrication of printed boards for microstrip, stripline, and high speed digital electrical and electronic circuits. This specification applies to the plastic substrate thickness defined in the specification sheets as measured over the dielectric only. As a general guideline, laminates controlled by this specification usually have a dissipation factor of less than 0.005.

Document History

IPC-4103
November 1, 2017
Specification for Base Materials for High Speed/High Frequency Applications
This specification covers the requirements for high speed/high frequency performance plastic substrates to be used for fabrication of printed boards for microstrip, stripline, and high speed digital...
IPC-4103
November 1, 2015
Specification for Base Materials for High Speed/High Frequency Applications
A description is not available for this item.
IPC-4103
January 1, 2014
Specification for Base Materials for High Speed/High Frequency Applications
This specification covers the requirements for high speed/high frequency performance plastic substrates to be used for fabrication of printed boards for microstrip, stripline, and high speed digital...
IPC-4103
December 1, 2011
Specification for Base Materials for High Speed/High Frequency Applications
This specification covers the requirements for high speed/high frequency performance plastic substrates to be used for fabrication of printed boards for microstrip, stripline, and high speed digital...
IPC-4103
January 1, 2002
Specification for Base Materials for High Speed/High Frequency Applications
This specification covers the requirements for high speed/high frequency base materials, herein referred to as laminate or bonding layer, to be used primarily for the fabrication of rigid or...

References

This document references:
TM-650 2.3.10B - Flammability of Laminate
Published by IPC on December 1, 1994
This test method is designed to determine the degree of flame resistance of metal-clad or unclad laminate. It is intended for use on laminate of thicknesses 0.51 mm [0.020 inch] and greater.
This document references:
TM-650 2.3.16.1C - Resin Content of Prepreg, by Treated Weight
Published by IPC on December 1, 1994
This method is designed to determine the resin content of a prepreg without removing the resin from the reinforcement. The basis weight of the fabric must be known. This method is applicable to both...
This document references:
TM-650 2.3.16.2 - Treated Weight of Prepreg
Published by IPC on December 1, 1994
This method is designed for determining the treated weight of a specific area of prepreg. Treated weight is an alternative to Resin Content Percent as a means of determining the usability and...
This document references:
TM-650 2.3.16B - Resin Content of Prepreg, by Burn-Off
Published by IPC on December 1, 1994
This method is designed to determine the resin content of a prepreg without removing the resin from the reinforcement. The basis weight of the fabric must be known. This method is applicable to both...
This document references:
TM-650 2.3.17D - Resin Flow Percent of Prepreg
Published by IPC on August 1, 1997
This test method is designed to measure the Resin Flow Percent by weight in prepreg.
This document is referenced by:
6012F (REDLINE + STANDARD) - Qualification and Performance Specification for Rigid Printed Boards
Published by IPC on September 1, 2023
A description is not available for this item.
This document is referenced by:
EN 16602-70-60 - Space product assurance - Qualification and Procurement of printed circuit boards
Published by CEN on July 1, 2019
This standard specifies the requirements for the PCB manufacturer, the procurement authority and the qualification authority for qualification and procurement of PCB technology. ECSS-Q-ST-70-60 is...
This document is referenced by:
CEI UNI EN 16602-70-60 - Space product assurance - Qualification and Procurement of printed circuit boards
Published by CEI on October 1, 2019
This standard specifies the requirements for the PCB manufacturer, the procurement authority and the qualification authority for qualification and procurement of PCB technology. ECSS-Q-ST-70-60 is...
This document is referenced by:
IPC-TM-650 2.6.7.2 - Thermal Shock, Thermal Cycle and Continuity
Published by IPC on March 1, 2020
This method subjects unpopulated test specimens (samples) to sudden, extreme changes in temperature in order to evaluate the quality of interconnects formed during the manufacturing processes....
This document is referenced by:
IPC-2222 - Sectional Design Standard for Rigid Organic Printed Boards
Published by IPC on October 1, 2020
This standard establishes the specific requirements for the design of rigid organic printed boards. The following overview describes what are the core knowledge and competencies to best serve in the...
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