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IPC-4103

Specification for Base Materials for High Speed/High Frequency Applications

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Organization: IPC
Publication Date: 1 November 2017
Status: active
Page Count: 72
scope:

This specification covers the requirements for high speed/high frequency performance plastic substrates to be used for fabrication of printed boards for microstrip, stripline, and high speed digital electrical and electronic circuits. This specification applies to the plastic substrate thickness defined in the specification sheets as measured over the dielectric only. As a general guideline, laminates controlled by this specification usually have a dissipation factor of less than 0.005.

Document History

IPC-4103
November 1, 2017
Specification for Base Materials for High Speed/High Frequency Applications
This specification covers the requirements for high speed/high frequency performance plastic substrates to be used for fabrication of printed boards for microstrip, stripline, and high speed digital...
IPC-4103
November 1, 2015
Specification for Base Materials for High Speed/High Frequency Applications
A description is not available for this item.
IPC-4103
January 1, 2014
Specification for Base Materials for High Speed/High Frequency Applications
This specification covers the requirements for high speed/high frequency performance plastic substrates to be used for fabrication of printed boards for microstrip, stripline, and high speed digital...
IPC-4103
December 1, 2011
Specification for Base Materials for High Speed/High Frequency Applications
This specification covers the requirements for high speed/high frequency performance plastic substrates to be used for fabrication of printed boards for microstrip, stripline, and high speed digital...
IPC-4103
January 1, 2002
Specification for Base Materials for High Speed/High Frequency Applications
This specification covers the requirements for high speed/high frequency base materials, herein referred to as laminate or bonding layer, to be used primarily for the fabrication of rigid or...

References

This document references:
IPC-A-142 - Specification for Finished Fabric Woven from Aramid for Printed Boards
Published by IPC on June 1, 1990
This specification covers finished fabrics woven from aramid yarns that are intended as a reinforcing material in laminated plastics for electrical and electronic use. All fabrics covered by this...
This document references:
IPC-CF-152 - Composite Metallic Material Specification for Printed Wiring Board
Published by IPC on December 1, 1997
This specification covers the requirements for copper/invar/copper (CIC), copper/molybdenum/copper (CMC), three-layer composite. The CIC material consists of copper bonded to each side of a layer of...
This document references:
IPC-QF-143 - Specification for Finished Fabric Woven from Quartz (Pure Fused Silica) for Printed Boards
Published by IPC on February 1, 1992
This specification covers finished fabrics woven from quartz fiber, yarns that are intended as a reinforcing material in laminated plastics for electrical and electronic use. Purpose This...
This document references:
IPC-SG-141 - Specification for Finished Fabric Woven from "S" Glass for Printed Boards
Published by IPC on February 1, 1992
This specification covers finished fabrics woven from "S" Glass Electrical Grade Glass Fiber, yarns that are intended as a reinforcing material in laminated plastics for electrical and electronic use.
This document references:
IPC-T-50 - Terms and Definitions for Interconnecting and Packaging Electronic Circuits
Published by IPC on May 1, 2015
This document is designed to provide definitions for terms commonly used in the electronics industry which have meanings specific to electronics. The definitions are intended to provide sufficient...
This document is referenced by:
6012D (REDLINE + STANDARD) - Qualification and Performance Specification for Rigid Printed Boards
Published by IPC on September 1, 2015
Statement of Scope This specification establishes and defines the qualification and performance requirements for the fabrication of rigid printed boards. Purpose The purpose of this specification is...
This document is referenced by:
SMC-S-010 - Technical Requirements for Electronic Parts, Materials, and Processes Used in Space Vehicles
Published by AIR FORCE on April 12, 2013
PURPOSE. This document establishes the minimum technical requirements for electronic parts, materials, and processes (electronic PMP) used in the design, development, and fabrication of space and...
This document is referenced by:
IPC-2141 - Design Guide for High-Speed Controlled Impedance Circuit Boards
Published by IPC on March 1, 2004
This guide is intended to be used by circuit designers, packaging engineers, printed board fabricators, and procurement personnel so that all may have a common understanding of each other’s area. The...
This document is referenced by:
IPC-2251 - Design Guide for the Packaging of High Speed Electronic Circuits
Published by IPC on November 1, 2003
The goal in electronic packaging is to transfer a signal from one device to one or more other devices through a conductor. Considerations include electrical noise, electromagnetic interference,...
This document is referenced by:
IPC-2221 - Generic Standard on Printed Board Design
Published by IPC on June 1, 2018
A description is not available for this item.
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