JEDEC JESD 22-B107
|Publication Date:||1 March 2011|
The tests mentioned herein are applicable for all package types. They are suitable for use in qualification and/or process monitor testing. The mechanical shear test (tape test) is recommended as an ongoing process monitor or lot acceptance test. Electrical or mechanical rejects may be used for these tests.
NOTE 1 This procedure does not apply to laser marked packages.
NOTE 2 The formulation of solvents herein is considered typical and representative of the desired stringency as far as the usual coatings and marks are concerned. Many available solvents that could be used are either insufficiently active, too stringent, or even dangerous to humans when in direct contact or when the fumes are inhaled.
NOTE 3 These tests should be considered a destructive test unless determined to be non destructive by previous evaluation.
The purpose of this test is to determine whether the marks on solid state semiconductor devices will remain legible (as defined per JESD22-B114) when subjected to the application and removal of labels or the use of solvents and cleaning solutions commonly used during the removal of solder flux residue from the printed circuit board manufacturing process.