UNLIMITED FREE
ACCESS TO THE WORLD'S BEST IDEAS

SUBMIT
Already a GlobalSpec user? Log in.

This is embarrasing...

An error occurred while processing the form. Please try again in a few minutes.

Customize Your GlobalSpec Experience

Select Your Free Newsletters

Industry Newsletters

Select Your Free Product Alerts

Finish!
Privacy Policy

This is embarrasing...

An error occurred while processing the form. Please try again in a few minutes.

IPC - J-STD-001 ITALIAN

Requirements for Soldered Electrical and Electronic Assemblies

active, Most Current
Buy Now
Organization: IPC
Publication Date: 1 February 2005
Status: active
Page Count: 88

Document History

J-STD-001 ITALIAN
February 1, 2005
Requirements for Soldered Electrical and Electronic Assemblies
A description is not available for this item.
J-STD-001 ITALIAN
February 1, 2005
Requirements for Soldered Electrical and Electronic Assemblies
Questo standard prescrive la pratica ed i requisiti per la realizzazione di saldature di assemblati elettrici ed elettronici. Storicamente, gli standard relativi all'assemblaggio elettronico...

References

This document references:
IPC-TM-650 2.6.3 - Moisture and Insulation Resistance, Printed Boards
Published by IPC on May 1, 2004
This test method is to determine the degradation of insulating materials by examination of the visual and electrical insulation resistance properties of printed board specimens after exposure to high...
This document references:
J-STD-004 - Requirements for Soldering Fluxes
Published by IPC on November 1, 2011
A description is not available for this item.
This document references:
IPC-A-610 - Acceptability of Electronic Assemblies
Published by IPC on October 1, 2017
This Standard is a collection of visual quality acceptability requirements for electronic assemblies. This Standard does not provide criteria for cross-section evaluation. This document presents...
This document references:
T-50N - Terms and Definitions for Interconnecting and Packaging Electronic Circuits
Published by IPC on November 1, 2021
This document is designed to provide definitions for terms commonly used in the electronics industry. The definitions are intended to provide sufficient clarity of detail such that a reader utilizing...
This document references:
IPC-TM-650 2.3.25 - Detection and Measurement of Ionizable Surface Contaminants by Resistivity of Solvent Extract (ROSE)
Published by IPC on November 1, 2012
1 Scope 1.1 Purpose These tests are used as process control tools; they can be used to inspect printed boards or printed board assemblies and determine if they conform to the monitoring level of the...
This document references:
IPC-9191 - General Guidelines for Implementation of Statistical Process Control (SPC)
Published by IPC on November 1, 1999
This guideline describes the general provisions for implementation of SPC and is intended for use by individuals in electronics and other industries involved in the planning, implementation, and...
This document references:
IPC-TM-650 2.4.22 - Bow and Twist (Percentage)
Published by IPC on June 1, 1999
This test method covers three procedures used to determine the bow and twist percentage of individual rigid printed boards, rigid portions of rigid-flex printed boards, and/or multiple printed...
This document references:
J-STD-006 - Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications Amendment 1
Published by IPC on October 1, 2017
A description is not available for this item.
This document references:
IPC-2221 - Generic Standard on Printed Board Design
Published by IPC on June 1, 2018
A description is not available for this item.
This document references:
J-STD-005 - Requirements for Soldering Pastes
Published by IPC on February 1, 2012
This standard prescribes general requirements for the characterization and testing of solder pastes used to make high quality electronic interconnections. This specification is a material quality...
View Less
View All
Advertisement