CENELEC - EN 62137-1-4
Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-4: Cyclic bending test
active, Most Current
| Organization: | CENELEC |
| Publication Date: | 1 February 2009 |
| Status: | active |
| Page Count: | 18 |
| ICS Code (Electronic component assemblies): | 31.190 |
Document History
EN 62137-1-4
February 1, 2009
Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-4: Cyclic bending test
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