Test Methods for Characterization of Printed Board Assembly Pad Cratering
|Publication Date:||1 December 2010|
This document provides test methods to evaluate the susceptibility of printed board assembly (PBA) materials and designs to cohesive dielectric failure underneath surface mount technology (SMT) attach pads. The test methods can be used to rank order and compare different printed board materials and design parameters, but do not define acceptance criteria.
Performance Classification This test method guideline recognizes that surface mount assemblies (SMAs) will be subject to variations in performance requirements based on end use. While performance classes are defined in IPC-6011, these performance classifications are not specific as to the required reliability. As of the publication of this standard, the acceptance criteria needs to be established as agreed between user and supplier (AABUS).
Definition of Terms The definition of all terms used herein shall be as specified in IPC-T-50, except as otherwise specified in 1.2.1 through 1.2.4.
BGA Ball Grid Array package.
Component Packaged semiconductor device.
Solder Joint/Ball The solder interconnection between a component and PBA.
Pad Cratering The formation of a cohesive (or adhesive) dielectric crack or fracture underneath the pad of a surface mount component, most commonly BGA packages.
Interpretation "Shall" is used throughout this specification whenever a requirement is intended to express a provision that is mandatory; deviation may be considered if sufficient data is supplied to justify the exception.
The words "should" and "may" are used whenever it is necessary to express non-mandatory provisions. "Will" is used to express a declaration of purpose. To assist the reader, the word "shall" is presented in bold characters.