GMNA - 9984824
Low Bake, Solventborne Conductive Rigid Primer for Plastics
|Publication Date:||1 September 2018|
This specification covers the requirements for a solventborne conductive low bake primer for use over plastics, including those with in-mold coatings. The surfacer shall be smooth, adhesion promoting, conductive surface for electrostatic application of subsequent coatings. The surfacer must be sandable, and have the ability to fill minor surface imperfections in the substrate. It must also provide ultraviolet (UV) light protection to any underlying coatings and the substrates. Materials approved to this standard have a target bake of 82 °C (180 °F) and a typical bake range of 76 °C to 135 °C (170 °F to 275 °F).
Material Description. This primer is part of the total painted product system and must provide a smooth, adhesion promoting coating direct to substrate or in-mold coating and to subsequent coatings. This specification shall be used in conjunction with the Approved Paint on Plastics Systems (APOPS), a part of the GM Materials Approved Source List, which lists approved substrate, cleaning, priming, and topcoat combinations. APOPS test requirements are defined in GMW14797.
Symbols. Not applicable.
Applicability. Primers covered under this specification are typically applied to rigid plastic substrates that could lose functional or dimensional integrity at higher bake temperatures. Primers are used under an approved topcoat system.