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GMNA - 9986337

Low Bake, Non-Conductive Waterborne Rigid Primer for Plastics

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Organization: GMNA
Publication Date: 1 September 2018
Status: active
Page Count: 3
scope:

This specification covers the requirements for a waterborne non-conductive low bake primer for use over plastics, including those with in-mold coatings. The surfacer shall be smooth and adhesion promoting surface. The surfacer must be sandable and have the ability, to fill minor surface imperfections in the substrate. It must also provide ultraviolet (UV) protection to any underlying coatings and the substrates.

Material Description. This primer is part of the total painted product system and must provide a smooth, adhesion-promoting coating direct to substrate or in-mold coating and to subsequent coatings. This specification shall be used in conjunction with the Approved Paint on Plastics Systems (APOPS), a section of the GM Materials Approved Source List which lists approved substrate, cleaning, priming, and topcoat combinations. APOPS test requirements are defined in GMW14797. Primers approved to this specification must cure and meet all performance requirements at bake temperatures ≤ 82 °C (180 °F).

Symbols. Not applicable.

Applicability. Primers covered under this specification are typically applied to rigid plastic substrates that could lose functional or dimensional integrity at higher bake temperatures. Primers are used under an approved topcoat system.

Remarks. Not applicable.

Document History

9986337
September 1, 2018
Low Bake, Non-Conductive Waterborne Rigid Primer for Plastics
This specification covers the requirements for a waterborne non-conductive low bake primer for use over plastics, including those with in-mold coatings. The surfacer shall be smooth and adhesion...
October 1, 2014
Low Bake, Non-Conductive Waterborne Rigid Primer for Plastics
This specification covers the requirements for a waterborne non-conductive low bake primer for use over plastics, including those with in-mold coatings. The surfacer shall be smooth and adhesion...
October 1, 2009
Low Bake, Nonconductive Waterborne Rigid Primer for Plastics
This specification covers the requirements for a low bake, nonconductive, waterborne primer surfacer for use over plastics, including those with in-mold coatings. The surfacer shall be smooth and...

References

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