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IEC 60749-29

Semiconductor devices – Mechanical and climatic test methods – Part 29: Latch-up test

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Organization: IEC
Publication Date: 1 April 2011
Status: active
Page Count: 52
ICS Code (Semiconductor devices in general): 31.080.01
scope:

Scope and object

This part of IEC 60749 covers the I-test and the overvoltage latch-up testing of integrated circuits.

This test is classified as destructive.

The purpose of this test is to establish a method for determining integrated circuit (IC) latchup characteristics and to define latch-up failure criteria. Latch-up characteristics are used in determining product reliability and minimizing "no trouble found" (NTF) and "electrical overstress" (EOS) failures due to latch-up.

This test method is primarily applicable to CMOS devices. Applicability to other technologies must be established.

The classification of latch-up as a function of temperature is defined in 3.1 and the failure level criteria are defined in 3.2

Document History

IEC 60749-29
April 1, 2011
Semiconductor devices – Mechanical and climatic test methods – Part 29: Latch-up test
Scope and object This part of IEC 60749 covers the I-test and the overvoltage latch-up testing of integrated circuits. This test is classified as destructive. The purpose of this test is to...
November 1, 2003
Semiconductor devices Mechanical and climatic test methods Part 29:Latch-up test
A description is not available for this item.

References

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