IEC 60749-43
Semiconductor devices - Mechanical and climatic test methods - Part 43: Guidelines for IC reliability qualification plans
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| Organization: | IEC |
| Publication Date: | 1 June 2017 |
| Status: | active |
| Page Count: | 78 |
| ICS Code (Semiconductor devices in general): | 31.080.01 |
scope:
This part of IEC 60749 gives guidelines for reliability qualification plans of semiconductor integrated circuit products (ICs). This document is not intended for military- and space-related applications.
NOTE 1 The manufacturer can use flexible sample sizes to reduce cost and maintain reasonable reliability by this guideline adaptation based on EDR-4708, AEC Q100, JESD47 or other relevant document can also be applicable if it is specified.
NOTE 2 The Weibull distribution method used in this document is one of several methods to calculate the appropriate sample size and test conditions of a given reliability project.
Document History
IEC 60749-43
June 1, 2017
Semiconductor devices - Mechanical and climatic test methods - Part 43: Guidelines for IC reliability qualification plans
This part of IEC 60749 gives guidelines for reliability qualification plans of semiconductor integrated circuit products (ICs). This document is not intended for military- and space-related...