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DLA - DSCC-DWG-V62/14601 REV A

MICROCIRCUIT, DIGITAL-LINEAR, DIGITAL DUAL SYNCHRONOUS BUCK POWER DRIVER, MONOLITHIC SILICON

active, Most Current
Organization: DLA
Publication Date: 12 March 2019
Status: active
Page Count: 12
scope:

This drawing documents the general requirements of a high performance digital dual synchronous buck power driver microcircuit, with an operating temperature range of -55°C to +125°C.

Document History

DSCC-DWG-V62/14601 REV A
March 12, 2019
MICROCIRCUIT, DIGITAL-LINEAR, DIGITAL DUAL SYNCHRONOUS BUCK POWER DRIVER, MONOLITHIC SILICON
This drawing documents the general requirements of a high performance digital dual synchronous buck power driver microcircuit, with an operating temperature range of -55°C to +125°C.
DSCC-DWG-V62/14601
November 12, 2013
MICROCIRCUIT, DIGITAL-LINEAR, DIGITAL DUAL SYNCHRONOUS BUCK POWER DRIVER, MONOLITHIC SILICON
This drawing documents the general requirements of a high performance digital dual synchronous buck power driver microcircuit, with an operating temperature range of -55°C to +125°C.

References

This document references:
JEDEC JESD 51 - Methodology for the Thermal Measurement of Component Packages (Single Semiconductor Device)
Published by JEDEC on December 1, 1995
This standard and its subsequent addendum's, provides a standard for thermal measurement that, if followed fully, will provide correct and meaningful data that will allow for determination of...
This document references:
JEDEC JESD 51-2 - Integrated Circuits Thermal Test Method Environmental Conditions - Natural Convection (Still Air)
Published by JEDEC on January 1, 2008
This document outlines the environmental conditions necessary to ensure accuracy and repeatability for a standard junction-to-ambient thermal resistance measurement in natural convection.
This document references:
JEDEC JESD 51-7 - High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages
Published by JEDEC on February 1, 1999
This fixturing further defines the environment for thermal test of packaged microelectronic devices. Its function is to provide an alternate mounting surface for the analysis of heat flow in...
This document references:
JEDEC JESD 51-8 - Integrated Circuit Thermal Test Method Environmental Conditions - Junction-to-Board
Published by JEDEC on October 1, 1999
This specification should be used in conjunction with the overview document JESD51, Methodology for the Thermal Measurement of Component Packages (Single Semiconductor Device) [1] and the electrical...
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