BSI - BS IEC 62047-31
Semiconductor devices - Microelectromechanical devices Part 31: Four-point bending test method for interfacial adhesion energy of layered MEMS materials
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| Organization: | BSI |
| Publication Date: | 30 April 2019 |
| Status: | active |
| Page Count: | 16 |
| ICS Code (Other semiconductor devices): | 31.080.99 |
Document History
BS IEC 62047-31
April 30, 2019
Semiconductor devices - Microelectromechanical devices Part 31: Four-point bending test method for interfacial adhesion energy of layered MEMS materials
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