UNLIMITED FREE ACCESS TO THE WORLD'S BEST IDEAS

close
Already an Engineering360 user? Log in.

This is embarrasing...

An error occurred while processing the form. Please try again in a few minutes.

Customize Your Engineering360 Experience

close
Privacy Policy

This is embarrasing...

An error occurred while processing the form. Please try again in a few minutes.

JEDEC JESD 22-B110

Mechanical Shock – Device and Subassembly

active, Most Current
Buy Now
Organization: JEDEC
Publication Date: 1 June 2019
Status: active
Page Count: 14
scope:

Device and Subassembly Mechanical Shock Test Method is intended to evaluate devices in the free state and assembled to printed wiring boards for use in electrical equipment. The method is intended to determine the compatibility of devices and subassemblies to withstand moderately severe shocks. The use of subassemblies is a means to test devices in usage conditions as assembled to printed wiring boards. Mechanical Shock due to suddenly applied forces, or abrupt change in motion produced by handling, transportation or field operation may disturb operating characteristics, particularly if the shock pulses are repetitive. This is a destructive test intended for device qualification.

Document History

JEDEC JESD 22-B110
June 1, 2019
Mechanical Shock – Device and Subassembly
Device and Subassembly Mechanical Shock Test Method is intended to evaluate devices in the free state and assembled to printed wiring boards for use in electrical equipment. The method is intended to...
July 1, 2013
Mechanical Shock – Component and Subassembly
Component and Subassembly Mechanical Shock Test Method is intended to evaluate components in the free state and assembled to printed wiring boards for use in electrical equipment. The method is...
November 1, 2004
Subassembly Mechanical Shock
The Subassembly Mechanical Shock Test Method is intended to describe a method to evaluate subassemblies for use in electrical equipment. It is intended to determine the compatibility of the...
November 1, 2004
Subassembly Mechanical Shock
The new test method JESD22-B110 provides guidance for in-situ testing of mechanical shock resistance of components as mounted in a subassembly. Using terms, procedures, and test levels in common with...
March 1, 2001
Subassembly Mechanical Shock
A description is not available for this item.

References

Advertisement