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IEC 62258-2

Semiconductor die products – Part 2: Exchange data formats

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Organization: IEC
Publication Date: 1 May 2011
Status: active
Page Count: 146
ICS Code (Other semiconductor devices): 31.080.99
scope:

Scope and object

This Part of IEC 62258 specifies the data formats that may be used for the exchange of data which is covered by other parts of the IEC 62258 series, as well as definitions of all parameters used according to the principles and methods of IEC 61360. It introduces a Device Data Exchange (DDX) format, with the prime goal of facilitating the transfer of adequate geometric data between die manufacturer and CAD/CAE user and formal information models that allow data exchange in other formats such as STEP physical file format, in accordance with ISO 10303-21, and XML. The data format has been kept intentionally flexible to permit usage beyond this initial scope.

It has been developed to facilitate the production, supply and use of semiconductor die products, including but not limited to:

• wafers,

• singulated bare die,

• die and wafers with attached connection structures,

• minimally or partially encapsulated die and wafers.

This standard reflects the DDX data format at version 1.3.0

Document History

IEC 62258-2
May 1, 2011
Semiconductor die products – Part 2: Exchange data formats
Scope and object This Part of IEC 62258 specifies the data formats that may be used for the exchange of data which is covered by other parts of the IEC 62258 series, as well as definitions of all...
June 1, 2005
Semiconductor die products Part 2: Exchange data formats
A description is not available for this item.

References

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