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BSI - BS EN 60068-2-83

Environmental testing Part 2-83: Tests - Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste

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Organization: BSI
Publication Date: 30 November 2011
Status: active
Page Count: 42
ICS Code (Electronic component assemblies): 31.190
ICS Code (Environmental testing): 19.040

Document History

October 10, 2023
Draft BS EN IEC 60068-2-83 Environmental testing Part 2-83: Tests - Test Tf: Solderability testing of electronic omponents for surface mounting devices (SMD) by the wetting balance method using solder paste
A description is not available for this item.
BS EN 60068-2-83
November 30, 2011
Environmental testing Part 2-83: Tests - Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste
A description is not available for this item.

References

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