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JEDEC JESD 22-A113

Preconditioning of Nonhermetic Surface Mount Devices Prior to Reliability Testing

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Organization: JEDEC
Publication Date: 1 April 2020
Status: active
Page Count: 38
scope:

This Test Method establishes an industry standard preconditioning flow for nonhermetic solid state SMDs that is representative of a typical industry multiple solder reflow operation. These SMDs should be subjected to the appropriate preconditioning sequence of this document by the manufacturer prior to being submitted to specific in-house reliability testing (qualification and reliability monitoring) to evaluate long term reliability (which might be impacted by solder reflow).

Devices that could be surface mounted, but are designed/intended to only be socketed, are out of scope of this test method.

NOTE For good correlation of results between moisture/reflow-induced stress sensitivity testing (per J-STD-020 and JESD22-A113) and actual reflow conditions used, identical temperature measurements by both the SMD manufacturer and the board assembler are necessary. Therefore, it is recommended that the package temperature at the top center of the package be determined during assembly board reflow profile setup, to ensure that it does not exceed the evaluation temperature based on package thickness and volume as stated in J-STD-020.

Document History

JEDEC JESD 22-A113
April 1, 2020
Preconditioning of Nonhermetic Surface Mount Devices Prior to Reliability Testing
This Test Method establishes an industry standard preconditioning flow for nonhermetic solid state SMDs that is representative of a typical industry multiple solder reflow operation. These SMDs...
November 1, 2016
Preconditioning of Nonhermetic Surface Mount Devices Prior to Reliability Testing
This Test Method establishes an industry standard preconditioning flow for nonhermetic solid state SMDs that is representative of a typical industry multiple solder reflow operation. These SMDs...
October 1, 2015
Preconditioning of Nonhermetic Surface Mount Devices Prior to Reliability Testing
This Test Method establishes an industry standard preconditioning flow for nonhermetic solid state SMDs that is representative of a typical industry multiple solder reflow operation. These SMDs...
October 1, 2008
Preconditioning of Nonhermetic Surface Mount Devices Prior to Reliability Testing
This Test Method establishes an industry standard preconditioning flow for nonhermetic solid state SMDs (surface mount devices) that is representative of a typical industry multiple solder reflow...
March 1, 2006
Preconditioning of Nonhermetic Surface Mount Devices Prior to Reliability Testing
A description is not available for this item.
August 1, 2003
Preconditioning of Nonhermetic Surface Mount Devices Prior to Reliability Testing
A description is not available for this item.
February 1, 2003
Preconditioning of Nonhermetic Surface Mount Devices Prior to Reliability Testing
A description is not available for this item.
March 1, 1999
Preconditioning of Nonhermetic Surface Mount Devices Prior to Reliability Testing
A description is not available for this item.
June 1, 1995
Test Method A113-A Preconditioning of Plastic Surface Mount Devices Prior to Reliability Testing
A description is not available for this item.
January 1, 1995
Test Method A113-A Preconditioning of Plastic Surface Mount Devices Prior to Reliability Testing
A description is not available for this item.

References

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