IPC-TM-650 2.6.7.2
Thermal Shock, Thermal Cycle and Continuity
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| Organization: | IPC |
| Publication Date: | 1 March 2020 |
| Status: | active |
| Page Count: | 5 |
scope:
This method subjects unpopulated test specimens (samples) to sudden, extreme changes in temperature in order to evaluate the quality of interconnects formed during the manufacturing processes.
Purpose
This method shall be used to simulate the thermodynamic effects of extreme temperature variations. The use of this method is intended to be able to capture ''infant mortality'' types of manufacturing defects.
This method may provide for qualification, quality conformance testing and lot acceptance.
Document History
IPC-TM-650 2.6.7.2
March 1, 2020
Thermal Shock, Thermal Cycle and Continuity
This method subjects unpopulated test specimens (samples) to sudden, extreme changes in temperature in order to evaluate the quality of interconnects formed during the manufacturing processes....
May 1, 2004
Thermal Shock, Continuity and Microsection, Printed Board
This method is to determine the physical endurance of printed boards to sudden changes of temperature. It is designed to expose specimens to a series of high and low temperature excursions to cause...
August 1, 1997
Thermal Shock, Continuity and Microsection, Printed Board
A description is not available for this item.
July 1, 1993
Thermal Shock-Rigid Printed Boards
A description is not available for this item.