IEC 60749-20 REDLINE
Semiconductor devices – Mechanical and climatic test methods – Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
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| Organization: | IEC |
| Publication Date: | 1 August 2020 |
| Status: | active |
| Page Count: | 88 |
| ICS Code (Semiconductor devices in general): | 31.080.01 |
scope:
This part of IEC 60749 provides a means of assessing the resistance to soldering heat of semiconductors packaged as plastic encapsulated surface mount devices (SMDs). This test is destructive.
Document History
IEC 60749-20 REDLINE
August 1, 2020
Semiconductor devices – Mechanical and climatic test methods – Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
This part of IEC 60749 provides a means of assessing the resistance to soldering heat of semiconductors packaged as plastic encapsulated surface mount devices (SMDs). This test is destructive.