UNLIMITED FREE
ACCESS TO THE WORLD'S BEST IDEAS

SUBMIT
Already a GlobalSpec user? Log in.

This is embarrasing...

An error occurred while processing the form. Please try again in a few minutes.

Customize Your GlobalSpec Experience

Select Your Free Newsletters

Industry Newsletters

Select Your Free Product Alerts

Finish!
Privacy Policy

This is embarrasing...

An error occurred while processing the form. Please try again in a few minutes.

SNV - SN EN IEC 62148-19

Fibre optic active components and devices - Package and interface standards - Part 19: Photonic chip scale package

active, Most Current
Organization: SNV
Publication Date: 1 July 2019
Status: active
Page Count: 5
ICS Code (Fibre optic interconnecting devices): 33.180.20

Document History

SN EN IEC 62148-19
July 1, 2019
Fibre optic active components and devices - Package and interface standards - Part 19: Photonic chip scale package
A description is not available for this item.

References

This document references:
IEC 60191-1 - Mechanical standardization of semiconductor devices - Part 1: General rules for the preparation of outline drawings of discrete devices
Published by IEC on January 1, 2018
This part of IEC 60191 gives guidelines on the preparation of outline drawings of discrete devices, including discrete surface-mounted semiconductor devices with lead count less than 8. For the...
This document references:
IEC 60191-2 - Amendment 16 Mechanical Standardization of Semiconductor Devices - Part 2: Dimensions
Published by IEC on July 1, 2007
A description is not available for this item.
This document references:
IEC 60191-3 - Mechanical Standardization of Semiconductor Devices - Part 3: General Rules for the Preparation of Outline Drawings of Integrated Circuits
Published by IEC on October 1, 1999
A description is not available for this item.
This document references:
IEC 60191-4 - Mechanical Standardization of Semiconductor Devices - Part 4: Coding System and Classification into Forms of Package Outlines for Semiconductor Device Packages
Published by IEC on March 1, 2018
This part of IEC 60191 specifies a method for the designation of package outlines and for the classification of forms of package outlines for semiconductor devices and a systematic method for...
This document references:
IEC 60191-5 - Mechanical Standardization of Semiconductor Devices - Part 5: Recommendations Applying to Integrated Circuit Packages Using Tape Automated Bonding (TAB)
Published by IEC on April 1, 1997
A description is not available for this item.
View Less
View All
Advertisement