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BSI - BS EN IEC 61760-3

Surface mounting technology Part 3: Standard method for the specification of components for Through Hole Reflow (THR) soldering

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Organization: BSI
Publication Date: 31 March 2021
Status: active
Page Count: 34
ICS Code (Electronic component assemblies): 31.190

Document History

BS EN IEC 61760-3
March 31, 2021
Surface mounting technology Part 3: Standard method for the specification of components for Through Hole Reflow (THR) soldering
A description is not available for this item.
BS EN 61760-3
June 30, 2010
Surface mounting technology Part 3: Standard method for the specification of components for Through Hole Reflow (THR) soldering
A description is not available for this item.

References

This document references:
EN 60068-2-58 - Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
Published by CENELEC on May 1, 2015
This part of IEC 60068 outlines test Td, applicable to surface mounting devices (SMD). This document provides procedures for determining the solderability, resistance to dissolution of metallization...
This document references:
EN 60068-2-77 - Environmental Testing Part 2-77: Tests - Test 77: Body Strength and Impact Shock
Published by CENELEC on April 1, 1999
A description is not available for this item.
This document references:
EN 60286-4 - Packaging of components for automatic handling - Part 4: Stick magazines for electronic components encapsulated in packages of different forms
Published by CENELEC on November 1, 2013
This part of IEC 60286 is applicable to stick magazines (including end stoppers) intended to be used for storage of electronic components, for transport from the manufacturer to the customer and for...
This document references:
EN 61191-3 - Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies
Published by CENELEC on September 1, 2017
This part of IEC 61191 prescribes requirements for lead and hole solder assemblies. The requirements pertain to those assemblies that totally use through-hole mounting technology (THT), or the THT...
This document references:
EN 62090 - Product package labels for electronic components using bar code and two- dimensional symbologies
Published by CENELEC on July 1, 2017
This document applies to labels on the packaging of electronic components for automatic handling in B2B processes. These labels use linear bar code and two-dimensional (2D) symbols. Labels for direct...
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