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ECIA - EIA-364-70D

TP-70D Temperature Rise Versus Current Test Procedure for Electrical Connectors and Sockets

active, Most Current
Organization: ECIA
Publication Date: 1 May 2021
Status: active
Page Count: 19
scope:

This procedure establishes the test procedures for determining temperature rise versus current for connectors and sockets with conductor sizes equal to or less than 0000 AWG or equivalent.

Document History

EIA-364-70D
May 1, 2021
TP-70D Temperature Rise Versus Current Test Procedure for Electrical Connectors and Sockets
This procedure establishes the test procedures for determining temperature rise versus current for connectors and sockets with conductor sizes equal to or less than 0000 AWG or equivalent.
EIA-364-70
July 1, 2014
TP-70C Temperature Rise Versus Current Test Procedure for Electrical Connectors and Sockets
This procedure establishes the test procedures for determining temperature rise versus current for connectors and sockets with conductor sizes equal to or less than 0000 AWG or equivalent.
EIA-364-70
June 1, 2007
TP-70B TEMPERATURE RISE VERSUS CURRENT TEST PROCEDURE FOR ELECTRICAL CONNECTORS AND SOCKETS
This procedure establishes the test procedures for determining temperature rise versus current for connectors and sockets with conductor sizes equal to or less than 0000 AWG or equivalent. Test...
EIA-364-70
June 1, 2007
TP-70B Temperature Rise Versus Current Test Procedure for Electrical Connectors and Sockets
A description is not available for this item.
EIA-364-70
May 1, 1998
TP-70A Temperature Rise Versus Current Test Procedure for Electrical Connectors and Sockets
A description is not available for this item.
EIA-364-70
January 1, 1992
TP-70 Test Procedure for Current vs Temperature Rise of Electrical Connectors
A description is not available for this item.
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References

This document is referenced by:
MIL-DTL-83734J - SOCKETS, PLUG-IN ELECTRONIC COMPONENTS, DUAL-IN-LINE (DIPS) AND SINGLE-IN-LINE PACKAGES (SIPS), GENERAL SPECIFICATION FOR
Published by DLA on April 25, 2022
Scope. This specification covers plug-in electronic component sockets for use on panel boards, printed circuit boards, and microelectronic components (see 6.1).
This document is referenced by:
MIL-DTL-24308K (1) - CONNECTORS, ELECTRIC, RECTANGULAR, NONENVIRONMENTAL, MINIATURE, POLARIZED SHELL, RACK AND PANEL, GENERAL SPECIFICATION FOR
Published by DLA on December 5, 2022
Scope. This specification covers the requirements for nonenvironmental, polarized shell, miniature, rack and panel connectors having pin and socket, crimp (removable), solder (nonremovable), or...
This document is referenced by:
IEEE 802.3 - Standard for Ethernet Amendment 4: Physical Layers and Management Parameters for 50 Gb/s, 200 Gb/s, and 400 Gb/s Operation over Single‐Mode Fiber
Published by IEEE on November 7, 2019
Abstract: This amendment to IEEE Std 802.3-2018 adds Physical Layer (PHY) specifications and management parameters for 50 Gb/s, 200 Gb/s, and 400 Gb/s operation over single-mode fiber with reaches of...
This document is referenced by:
MIL-PRF-39012F (4) - CONNECTORS, COAXIAL, RADIO FREQUENCY, GENERAL SPECIFICATION FOR
Published by DLA on July 15, 2022
Scope. This specification covers the general requirements and tests for radio frequency connectors used with flexible RF cables and certain other types of coaxial transmission lines.
This document is referenced by:
MIL-DTL-28840E (2) - CONNECTORS, ELECTRICAL, CIRCULAR, THREADED, HIGH SHOCK, HIGH DENSITY, SHIPBOARD, CLASS D, GENERAL SPECIFICATION FOR
Published by DLA on September 9, 2022
Scope. This specification covers circular electrical connectors with removable crimp type, front release contacts. These connectors are for use with jacketed cables in shipboard applications....
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