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CEI - EN IEC 61760-1

Surface mounting technology Part 1: Standard method for the specification of surface mounting components (SMDs)

active, Most Current
Organization: CEI
Publication Date: 1 May 2021
Status: active
Page Count: 52
ICS Code (Mechanical structures for electronic equipment): 31.240
scope:

This part of IEC 61760 defines requirements for component specifications of electronic components that are intended for usage in surface mounting technology. To this end, it specifies a reference set of process conditions and related test conditions to be considered when compiling component specifications.

The objective of this document is to ensure that a wide variety of SMDs can be subjected to the same placement, mounting and subsequent processes (e.g. cleaning, inspection) during assembly. This document defines tests and requirements that need to be part of any SMD component's general, sectional or detail specification. In addition, this document provides component users and manufacturers with a reference set of typical process conditions used in surface mounting technology.

Some of the requirements for component specifications in this document are also applicable to components with leads intended for mounting on a circuit board. Cases for which this is appropriate are indicated in the relevant subclauses.

Document History

EN IEC 61760-1
May 1, 2021
Surface mounting technology Part 1: Standard method for the specification of surface mounting components (SMDs)
This part of IEC 61760 defines requirements for component specifications of electronic components that are intended for usage in surface mounting technology. To this end, it specifies a reference set...
March 1, 2007
Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs)
La presente Norma fornisce un insieme di condizioni inerenti i processi di produzione delle schede e riguardanti le condizioni di prova da utilizzare per preparare le specifiche dei componenti...
October 1, 2006
Tecnologia di montaggio superficiale - Parte 1: Metodo normalizzato per la specifica di componenti a montaggio superficiale (SMD)
La presente Norma fornisce un insieme di condizioni inerenti i processi di produzione delle schede e riguardanti le condizioni di prova da utilizzare per preparare le specifiche dei componenti...
October 1, 2000
Tecnologia di montaggio superficiale - Parte 1: Metodo normalizzato per la specifica di montaggio superficiale di componenti (SMD)
La presente Norma fornisce una serie di riferimenti delle condizioni di processo e le relative condizioni di prova da utilizzare in fase di elaborazione delle specifiche dei componenti. L’obiettivo è...

References

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