BSI - BS IEC 62047-38
Semiconductor devices - Micro-electromechanical devices Part 38: Test method for adhesion strength of metal powder paste in MEMS interconnection
active, Most Current
| Organization: | BSI |
| Publication Date: | 31 July 2021 |
| Status: | active |
| Page Count: | 16 |
| ICS Code (Other semiconductor devices): | 31.080.99 |
Document History
BS IEC 62047-38
July 31, 2021
Semiconductor devices - Micro-electromechanical devices Part 38: Test method for adhesion strength of metal powder paste in MEMS interconnection
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