BSI - BS EN IEC 60749-37
Semiconductor devices - Mechanical and climatic test methods Part 37: Board level drop test method using an accelerometer
active, Most Current
| Organization: | BSI |
| Publication Date: | 30 November 2022 |
| Status: | active |
| Page Count: | 28 |
| ICS Code (Semiconductor devices in general): | 31.080.01 |
Document History
BS EN IEC 60749-37
November 30, 2022
Semiconductor devices - Mechanical and climatic test methods Part 37: Board level drop test method using an accelerometer
A description is not available for this item.
May 30, 2008
Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer
A description is not available for this item.