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BSI - BS EN 60749-37

Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer

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Organization: BSI
Publication Date: 30 May 2008
Status: active
Page Count: 22
ICS Code (Semiconductor devices in general): 31.080.01

Document History

BS EN IEC 60749-37
November 30, 2022
Semiconductor devices - Mechanical and climatic test methods Part 37: Board level drop test method using an accelerometer
A description is not available for this item.
BS EN 60749-37
May 30, 2008
Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer
A description is not available for this item.

References

This document references:
IEC 60749-20 - Semiconductor devices – Mechanical and climatic test methods – Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
Published by IEC on August 1, 2020
This part of IEC 60749 provides a means of assessing the resistance to soldering heat of semiconductors packaged as plastic encapsulated surface mount devices (SMDs). This test is destructive.
This document references:
IEC 60749-20-1 - Semiconductor devices – Mechanical and climatic test methods – Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat
Published by IEC on June 1, 2019
This part of IEC 60749 applies to all devices subjected to bulk solder reflow processes during PCB assembly, including plastic encapsulated packages, process sensitive devices, and other...
This document references:
IEC 60749-40 - Semiconductor devices – Mechanical and climatic test methods – Part 40: Board level drop test method using a strain gauge
Published by IEC on July 1, 2011
This part of IEC 60749 is intended to evaluate and compare drop performance of a surface mount semiconductor device for handheld electronic product applications in an accelerated test environment,...
This document references:
IEC 60068-2-7 - Amendment 1 - Basic environmental testing procedures – Part 2-7: Tests – Test Ga and guidance: Acceleration, steady state
Published by IEC on June 1, 1986
To prove the structural suitability equipment and other electrotechnical when subjected to forces produced and the satisfactory performance of components, products, hereinafter referred to as...
This document references:
IEC 60749-10 - Semiconductor Devices - Mechanical and Climatic Test Methods - Part 10: Mechanical Shock CORRIGENDUM 1
Published by IEC on August 1, 2003
A description is not available for this item.
This document is referenced by:
BS EN 60749-20-1 - Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat
Published by BSI on July 31, 2009
A description is not available for this item.
This document is referenced by:
BS EN 60749-40 - Semiconductor devices - Mechanical and climatic test methods Part 40: Board level drop test method using a strain gauge
Published by BSI on September 30, 2011
A description is not available for this item.
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