ECIA - EIA-887-B
Resistors, Thin Film Array on Silicon - Molded
active, Most Current
| Organization: | ECIA |
| Publication Date: | 1 October 2023 |
| Status: | active |
| Page Count: | 14 |
scope:
Introduction
This specification defines the requirements for a family of thin film resistor networks on silicon with various configurations, packaged in a molded, JEDEC-approved package.
Document History
EIA-887-B
October 1, 2023
Resistors, Thin Film Array on Silicon - Molded
Introduction
This specification defines the requirements for a family of thin film resistor networks on silicon with various configurations, packaged in a molded, JEDEC-approved package.
January 1, 2007
Thin Film Resistor Network Specification
Introduction
This specification defines the requirements for a family of thin film resistor networks on silicon with various configurations, packaged in a molded, JEDEC-approved package.
January 1, 2007
Thin Film Resistor Network Specification
Introduction
This specification defines the requirements for a family of thin film resistor networks on silicon with various configurations, packaged in a molded, JEDEC-approved package.
April 1, 2001
Thin Film Resistor Network Specification
This specification was prepared by the P-1 Committee on Resistive Components of the Electronic Industries Alliance’s sector Electronic Components, Assemblies, Equipment & Supplies Association...