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DLA - DSCC-VID-V62/13624 REV B

MICROCIRCUIT, DIGITAL, MIXED SIGNAL MICROCONTROLLER, MONOLITHIC SILICON

active, Most Current
Organization: DLA
Publication Date: 20 November 2023
Status: active
Page Count: 38
scope:

Scope.

This drawing documents the general requirements of a high performance mixed signal microcontroller microcircuit, with an operating temperature range of -40°C to +125°C.

Document History

DSCC-VID-V62/13624 REV B
November 20, 2023
MICROCIRCUIT, DIGITAL, MIXED SIGNAL MICROCONTROLLER, MONOLITHIC SILICON
Scope. This drawing documents the general requirements of a high performance mixed signal microcontroller microcircuit, with an operating temperature range of -40°C to +125°C.
DSCC-VID-V62/13624 REV A
August 9, 2018
MICROCIRCUIT, DIGITAL, MIXED SIGNAL MICROCONTROLLER, MONOLITHIC SILICON
This drawing documents the general requirements of a high performance mixed signal microcontroller microcircuit, with an operating temperature range of -40°C to +125°C.
DSCC-VID-V62/13624
April 7, 2014
MICROCIRCUIT, DIGITAL, MIXED SIGNAL MICROCONTROLLER, MONOLITHIC SILICON
This drawing documents the general requirements of a high performance mixed signal microcontroller microcircuit, with an operating temperature range of -40°C to +125°C.

References

This document references:
IPC/JEDEC J-STD-020F - Moisture/Reflow Sensitivity Classification for Non-hermetic Surface Mount Devices (SMDs)
Published by IPC on December 1, 2022
This classification procedure applies to all non-hermetic SMDs, which, because of absorbed moisture, could be sensitive to damage during solder reflow. The term SMD as used in this document means...
This document references:
JEP95 BOOK 1 - Book One Registered and Standard Outlines for Solid State and Related Products
Published by JEDEC on March 1, 1997
PREFACE This Publication contains those solid state product outlines and other associated drawings that have been registered and assigned a JEDEC designation and are printed on white paper. Product...
This document references:
JEP95 BOOK 2 - Registered and Standard Outlines for Solid State and Related Products
Published by JEDEC on March 1, 1997
A description is not available for this item.
This document references:
JEP95 BOOK 3 MO SECTIONS - Book Three Registered and Standard Outlines for Solid State and Related Products
Published by JEDEC on March 1, 1997
A description is not available for this item.
This document references:
JEDEC JESD 51 - Methodology for the Thermal Measurement of Component Packages (Single Semiconductor Device)
Published by JEDEC on December 1, 1995
This standard and its subsequent addendum's, provides a standard for thermal measurement that, if followed fully, will provide correct and meaningful data that will allow for determination of...
This document references:
JEDEC JESD 51-2 - Integrated Circuits Thermal Test Method Environmental Conditions - Natural Convection (Still Air)
Published by JEDEC on January 1, 2008
This document outlines the environmental conditions necessary to ensure accuracy and repeatability for a standard junction-to-ambient thermal resistance measurement in natural convection.
This document references:
JEDEC JESD 51-7 - High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages
Published by JEDEC on February 1, 1999
This fixturing further defines the environment for thermal test of packaged microelectronic devices. Its function is to provide an alternate mounting surface for the analysis of heat flow in...
This document references:
JEDEC JESD 51-8 - Integrated Circuit Thermal Test Method Environmental Conditions - Junction-to-Board
Published by JEDEC on October 1, 1999
This specification should be used in conjunction with the overview document JESD51, Methodology for the Thermal Measurement of Component Packages (Single Semiconductor Device) [1] and the electrical...
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