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IPC - TM-650 2.4.21.1C

Bond Strength, Surface Mount Lands Perpendicular Pull Method

inactive, Most Current
Organization: IPC
Publication Date: 1 May 1991
Status: inactive
Page Count: 3

Document History

TM-650 2.4.21.1C
May 1, 1991
Bond Strength, Surface Mount Lands Perpendicular Pull Method
A description is not available for this item.

References

This document is referenced by:
IPC-6015 - Qualification and Performance Specification for Organic Multichip Module (MCM-L) Mounting and Interconnecting Structures
Published by IPC on February 1, 1998
This specification establishes the specific requirements for the organic mounting structure used to interconnect chip components, which in combination form the completed functional Organic...
This document is referenced by:
9701B - Thermal Cycling Test Method for Fatigue Life Characterization of Surface Mount Attachments
Published by IPC on February 1, 2022
This specification establishes a thermal cycling test method to characterize the fatigue lifetimes of surface mount solder attachments of electronic assemblies. The surface mount devices may be...
This document is referenced by:
IPC-9701 CHINESE - Performance Test Methods and Qualification Requirements for Surface Mount Solder Attachments
Published by IPC on February 1, 2006
This specification establishes specific test methods to evaluate the performance and reliability of surface mount solder attachments of electronic assemblies. It further establishes different levels...
This document is referenced by:
IPC-6012 - Medical Applications Addendum to IPC-6012E, Qualification and Performance Specification for Rigid Printed Boards
Published by IPC on August 1, 2020
This Specification covers qualification and performance requirements of Rigid Printed Board for Medical Device Applications. The Printed Boards may have a design that contains HDI and Design Level D...
This document is referenced by:
MIL-PRF-55110 - PRINTED WIRING BOARD, RIGID, GENERAL SPECIFICATION FOR
Published by NPFC on May 16, 2020
Scope. This specification establishes the performance and qualification requirements for rigid single-sided, double-sided, and multilayered printed wiring boards with or without plated through holes...
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