IPC-9701 CHINESE
Performance Test Methods and Qualification Requirements for Surface Mount Solder Attachments
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| Organization: | IPC |
| Publication Date: | 1 February 2006 |
| Status: | active |
| Page Count: | 32 |
scope:
This specification establishes specific test methods to evaluate the performance and reliability of surface mount solder attachments of electronic assemblies. It further establishes different levels of performance and reliability of the solder attachments of surface mount devices to rigid, flexible and rigid-flex circuit structures. In addition, it provides an approximate means of relating the results from these performance tests to the reliability of solder attachments for the use environments and conditions of electronic assemblies.
Document History
IPC-9701 CHINESE
February 1, 2006
Performance Test Methods and Qualification Requirements for Surface Mount Solder Attachments
This specification establishes specific test methods to evaluate the performance and reliability of surface mount solder attachments of electronic assemblies. It further establishes different levels...