IPC-9502
PWB Assembly Soldering Process Guideline for Electronic Components
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| Organization: | IPC |
| Publication Date: | 1 April 1999 |
| Status: | active |
| Page Count: | 23 |
scope:
This document describes manufacturing solder process limits that components subjected to IPC-9501, IPC-9503, IPC-9504 and J-STD-020 would survive. It does not include optimum conditions for assembly, but rather guides to assure components are not damaged.
This document applies to both surface-mount (SM) and through-hole (TH) components that are wave soldered, reflowed or hand soldered. This document is intended to complement other industry documents, listed in applicable documents.
Note: This document does not address the increased temperature requirements of lead-free solders.
Document History
IPC-9502
April 1, 1999
PWB Assembly Soldering Process Guideline for Electronic Components
This document describes manufacturing solder process limits that components subjected to IPC-9501, IPC-9503, IPC-9504 and J-STD-020 would survive. It does not include optimum conditions for assembly,...