BSI - BS EN 60191-6-22
Mechanical standardization of semiconductor devices Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silicon Fine-pitch Land Grid Array (S-FBGA and S-FLGA)
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| Organization: | BSI |
| Publication Date: | 30 April 2013 |
| Status: | active |
| Page Count: | 20 |
| ICS Code (Semiconductor devices in general): | 31.080.01 |
Document History
BS EN 60191-6-22
April 30, 2013
Mechanical standardization of semiconductor devices Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silicon Fine-pitch Land Grid Array (S-FBGA and S-FLGA)
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