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BSI - BS EN 61189-11

Test methods for electrical materials, printed boards and other interconnection structures and assemblies Part 11: Measurement of melting temperature or melting temperature ranges of solder alloys

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Organization: BSI
Publication Date: 31 July 2013
Status: active
Page Count: 20
ICS Code (Printed circuits and boards): 31.180

Document History

BS EN 61189-11
July 31, 2013
Test methods for electrical materials, printed boards and other interconnection structures and assemblies Part 11: Measurement of melting temperature or melting temperature ranges of solder alloys
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References

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