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CEN - EN ISO 9453

Soft solder alloys - Chemical compositions and forms

active, Most Current
Organization: CEN
Publication Date: 1 October 2020
Status: active
Page Count: 24
ICS Code (Brazing and soldering): 25.160.50
scope:

This document specifies the requirements for chemical composition for soft solder alloys containing two or more of: tin, lead, antimony, copper, silver, bismuth, zinc, indium and/or cadmium.

An indication of the forms generally available is also included.

Document History

EN ISO 9453
October 1, 2020
Soft solder alloys - Chemical compositions and forms
This document specifies the requirements for chemical composition for soft solder alloys containing two or more of: tin, lead, antimony, copper, silver, bismuth, zinc, indium and/or cadmium. An...
EN ISO 9453
August 1, 2014
Soft solder alloys - Chemical compositions and forms
WARNING - National or regional regulations may limit the employment of certain alloys. This International Standard specifies the requirements for chemical composition for soft solder alloys...
EN ISO 9453
October 1, 2006
Soft solder alloys - Chemical compositions and forms
A description is not available for this item.

References

This document references:
IEC 61190-1-3 - Attachment materials for electronic assembly – Part 1-3: Requirements for electronic grade solder alloys and fluxed and nonfluxed solid solder for electronic soldering applications
Published by IEC on December 1, 2017
This part of IEC 61190 prescribes the requirements and test methods for electronic grade solder alloys, for fluxed and non-fluxed bar, ribbon, powder solders and solder paste, for electronic...
This document references:
ISO 3677 - Filler metal for soldering and brazing - Designation
Published by ISO on September 15, 2016
This International Standard specifies designations for filler materials for soldering and brazing, on the basis of their chemical composition. For brazing materials only, the designation includes...
This document is referenced by:
BS EN 60851-4 - TC - Tracked Changes (Redline) - Winding wires — Test methods Part 4: Chemical properties
Published by BSI on February 26, 2020
A description is not available for this item.
This document is referenced by:
BS EN IEC 61190-1-3 - TC - Tracked Changes (Redline) - Attachment materials for electronic assembly Part 1-3: Requirements for electronic grade solder alloys and fluxed and nonfluxed solid solder for electronic soldering applications
Published by BSI on February 27, 2020
A description is not available for this item.
This document is referenced by:
BS EN 1254-1 - Copper and copper alloys — Plumbing fittings Part 1: Capillary fittings for soldering or brazing to copper tubes
Published by BSI on June 30, 2021
A description is not available for this item.
This document is referenced by:
BS EN 61189-3 - Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)
Published by BSI on March 31, 2008
A description is not available for this item.
This document is referenced by:
BS EN 61190-1-2 - Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
Published by BSI on June 30, 2014
A description is not available for this item.
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