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CEN - EN ISO 9453

Soft solder alloys - Chemical compositions and forms

inactive
Organization: CEN
Publication Date: 1 August 2014
Status: inactive
Page Count: 28
ICS Code (Brazing and soldering): 25.160.50
scope:

WARNING - National or regional regulations may limit the employment of certain alloys.

This International Standard specifies the requirements for chemical composition for soft solder alloys containing two or more of tin, lead, antimony, copper, silver, bismuth, zinc, indium and/or cadmium.

An indication of the forms generally available is also included.

Document History

EN ISO 9453
October 1, 2020
Soft solder alloys - Chemical compositions and forms
This document specifies the requirements for chemical composition for soft solder alloys containing two or more of: tin, lead, antimony, copper, silver, bismuth, zinc, indium and/or cadmium. An...
EN ISO 9453
August 1, 2014
Soft solder alloys - Chemical compositions and forms
WARNING - National or regional regulations may limit the employment of certain alloys. This International Standard specifies the requirements for chemical composition for soft solder alloys...
EN ISO 9453
October 1, 2006
Soft solder alloys - Chemical compositions and forms
A description is not available for this item.

References

This document references:
IEC 61190-1-3 - Attachment materials for electronic assembly – Part 1-3: Requirements for electronic grade solder alloys and fluxed and nonfluxed solid solder for electronic soldering applications
Published by IEC on December 1, 2017
This part of IEC 61190 prescribes the requirements and test methods for electronic grade solder alloys, for fluxed and non-fluxed bar, ribbon, powder solders and solder paste, for electronic...
This document references:
ISO 3677 - Filler metal for soldering and brazing - Designation
Published by ISO on September 15, 2016
This International Standard specifies designations for filler materials for soldering and brazing, on the basis of their chemical composition. For brazing materials only, the designation includes...
This document is referenced by:
BS EN IEC 61190-1-3 - Attachment materials for electronic assembly Part 1-3: Requirements for electronic grade solder alloys and fluxed and nonfluxed solid solder for electronic soldering applications
Published by BSI on March 31, 2018
A description is not available for this item.
This document is referenced by:
BS EN 62878-1-1 - Device embedded substrate Part 1-1: Generic specification — Test methods
Published by BSI on July 31, 2015
A description is not available for this item.
This document is referenced by:
BS EN 62326-20 - Printed boards Part 20: Printed circuit boards for high-brightness LEDs
Published by BSI on May 31, 2016
A description is not available for this item.
This document is referenced by:
BS EN 60851-4 - Winding wires - Test methods Part 4: Chemical properties
Published by BSI on October 31, 2016
A description is not available for this item.
This document is referenced by:
EN 60851-4 - Winding wires - Test methods - Part 4: Chemical properties
Published by CENELEC on October 1, 2016
This part of IEC 60851 specifies the following chemical properties tests: • Test 12: Resistance to solvents; • Test 16: Resistance to refrigerants; • Test 17: Solderability; • Test 20: Resistance to...
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