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CEN - EN ISO 9453

Soft solder alloys - Chemical compositions and forms

inactive
Organization: CEN
Publication Date: 1 October 2006
Status: inactive
Page Count: 22
ICS Code (Brazing and soldering): 25.160.50

Document History

EN ISO 9453
October 1, 2020
Soft solder alloys - Chemical compositions and forms
This document specifies the requirements for chemical composition for soft solder alloys containing two or more of: tin, lead, antimony, copper, silver, bismuth, zinc, indium and/or cadmium. An...
EN ISO 9453
August 1, 2014
Soft solder alloys - Chemical compositions and forms
WARNING - National or regional regulations may limit the employment of certain alloys. This International Standard specifies the requirements for chemical composition for soft solder alloys...
EN ISO 9453
October 1, 2006
Soft solder alloys - Chemical compositions and forms
A description is not available for this item.

References

This document is referenced by:
SN EN 13148 - Copper and copper alloys - Hot-dip tinned strip
Published by SNV on December 1, 2010
This European Standard specifies: — the composition and tolerances on dimensions of strip produced by rolling in the thickness range from 0,10 mm up to and including 1,50 mm of copper and copper...
This document is referenced by:
EN 61189-11 - Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 11: Measurement of melting temperature or melting temperature ranges of solder alloys
Published by CENELEC on June 1, 2013
This part of IEC 61189 describes the measurement method of melting ranges of solder alloys that are mainly used for wiring of electrical equipment, for electrical and communication equipment, and for...
This document is referenced by:
BS EN IEC 61190-1-3 - Attachment materials for electronic assembly Part 1-3: Requirements for electronic grade solder alloys and fluxed and nonfluxed solid solder for electronic soldering applications
Published by BSI on March 31, 2018
A description is not available for this item.
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