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BSI - BS EN IEC 61190-1-3 - TC

Tracked Changes (Redline) - Attachment materials for electronic assembly Part 1-3: Requirements for electronic grade solder alloys and fluxed and nonfluxed solid solder for electronic soldering applications

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Organization: BSI
Publication Date: 27 February 2020
Status: active
Page Count: 111
ICS Code (Electronic component assemblies): 31.190

Document History

BS EN IEC 61190-1-3 - TC
February 27, 2020
Tracked Changes (Redline) - Attachment materials for electronic assembly Part 1-3: Requirements for electronic grade solder alloys and fluxed and nonfluxed solid solder for electronic soldering applications
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References

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