scope:

This drawing describes device requirements for class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices".

The complete PIN shall be as shown in the following example:

The device type(s) shall identify the circuit function as follows:

Device type Generic number Circuit function 01 82510 CHMOS single component asynchronous serial controller 1/ 02 82510 CHMOS single component asynchronous serial controller 2/

The case outline(s) shall be as designated in MIL-STD-1835 and as follows:

Outline letter Descriptive designator Terminals Package style X GDIP1-T28 or 28 dual-in-line package CDIP2-T28 3 CQCC1-N28 28 square leadless chip carrier

The lead finish shall be as specified in MIL-STD-883 (see 3.1 herein). Finish letter "X" shall not be marked on the microcircuit or its packaging. The "X" designation is for use in specifications when lead finishes A, B, and C are considered acceptable and interchangeable without preference.

Voltage on any pin with respect to GND- - - - - - - - −0.5 V dc to V_CC + 0.5 Storage temperature range - - - - - - - - - - - - - - −65°C to +150°C Maximum power dissipation (P_D) 3/ - - - - - - - - - - 250 mW Thermal resistance, junction-to-case (O_JC)- - - - - - See MIL-STD-1835 Junction Temperature (T_J) - - - - - - - - - - - - - - 150°C Lead temperature (soldering, 10 seconds)- - - - - - - 265°C

Supply voltage (V_CC)- - - - - - - - - - - - - - - - - 4.5 V dc to 5.5 V dc Case operating temperature range (T_C) - - - - - - - - −55°C to +125°C

intended Use:

Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes.