scope:

This method covers the measurement of bow and twist by maximum vertical displacement of an unrestrained panel of either cut to size panels or finished rigid printed boards including single- and double-sided, multilayer, and the rigid segments of rigid flex printed circuits. This test method is only applicable to laminates greater than or equal to 0.5 mm [0.020 in] in thickness. This test method can also be used after etching or after thermal stress with requirements as agreed between user and vendor.