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IEC 61190-1-1

Attachmant Materials for Electronic Assembly - Part 1-1: Requirements for Soldering Fluxes for High-Quality Interconnections in Electronics Assembly

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Organization: IEC
Publication Date: 1 March 2002
Status: active
Page Count: 50
ICS Code (Electronic component assemblies): 31.190

Document History

IEC 61190-1-1
March 1, 2002
Attachmant Materials for Electronic Assembly - Part 1-1: Requirements for Soldering Fluxes for High-Quality Interconnections in Electronics Assembly
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References

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